Electronics Forum | Mon May 27 14:34:33 EDT 2013 | bvdb
Suggest that you do search on this forum for "tombstoning". Regards, Bert
Electronics Forum | Mon Oct 26 19:10:52 EST 1998 | John Vaughan
I'm trying to find a source for a tilt device for use when doing touch-up soldering. Employee needs to raise the board above standard bench height for better access to the board and for better posture. Angle of the tilt device should be adjustable;
Electronics Forum | Thu Jul 15 07:08:29 EDT 2004 | pcbrown
Basically, it's a tilting problem of certain devices. Usually with axial by-pass caps tilting, which pulls the lead up through it's mounting hole. Other problems with components with leads cut to lenght to eliminate post-wave trimming. All suggestion
Electronics Forum | Fri Feb 09 01:41:46 EST 2007 | Muhammad Haris
CHECKS FIRST that your BGA doesn't tilt from pick & place machine. SECOND lead free paste have some problem that it solder the component whereever pick&place put the component while solder pastes having lead, put the component on its PCB pad like a
Electronics Forum | Mon Feb 12 01:19:27 EST 2007 | Wayne
the center part of the BGA balls may not fully reflow or melt and cause BGA tilt, not functioning working (only press then work) and etc..... the simple way to solve this issue is to use low temperature solder paste, it can melt in between 220 to 225
Electronics Forum | Tue Nov 28 14:27:05 EST 2017 | emeto
Without the details I will tell you that you have too much paste. PCB Pad is probably way bigger than the contact lead surface of the part, you overprint, and in the oven this solder have nowhere to go and tilts your part. Check datasheet.Cutting sma
Electronics Forum | Thu Dec 14 04:42:11 EST 2017 | jineshjpr
Can anybody suggest how can I achieve good solderability in convectional reflow oven If I reduced Convection Air Speed 80%. The whole purpose is to reduce 0402 LED tilting in the convectional reflow and the PCB having QFN with 60 to 120 sec soak, 30
Electronics Forum | Wed May 22 10:27:33 EDT 2002 | stefwitt
Fiducial recognition on the Siemens machine works like the Mydata. Once you select this option, fiducials will be recognized when a new program is send. You can also select recognition as part of the feeder refill function mode. There is no automatic
Electronics Forum | Thu Jun 12 03:34:23 EDT 2003 | sanjeevc
I would like to ask a question about SMT reflow > process. I did 10 pcs samples but all is fail. > The sample is double faces to have components > (up-side has 4 pcs of BGA and down-side has 3 BGA > and 2 QFP). And I saw some of BGA which is > t
Electronics Forum | Sun Mar 31 22:50:28 EST 2002 | ianchan
Nope, we do not have solder beads, like we said, what we have are near perfect solder fillets except for the portion where the component is "floating OFF" the pcb pads. We are now mucking through the IPC-A-610C for specifications dictation on "tilted
