Electronics Forum | Wed Dec 15 16:20:48 EST 2004 | darby
I read with interest in September Circuits Assembly magazine an article entitled "Reducing Variation Through 'Intelligent' Stencils. In this the authors propose that by REDUCING stencil thickness from 0.005" to 0.004", the paste deposit volume will I
Electronics Forum | Mon Nov 21 16:29:02 EST 2005 | pjc
Here is Manix web site: http://www.manixmfg.com/ Yes, the zone temps can be set high, but the thermal transfer efficiency is very low. I was profiling one of these ovens last week. To get 215C on the board you have to set the zone temp well over 30
Electronics Forum | Wed Feb 15 08:47:09 EST 2006 | pjc
Yes, doing the DoEs on your wave to achieve optimum settings that deliver the best results on your worst board is correct method. If not clear on the process, there are still wave solder process classes out there you can attend or hire in-house. If y
Electronics Forum | Wed Apr 18 09:16:51 EDT 2007 | Cecil
We currently have an assembly that we have to mask the surface of several (24)SMT components where thermal compound is applied at a latter operation. These component packages vary from BGA's to QFP's. After the thermal compound is applied the PWA is
Electronics Forum | Fri Apr 27 11:01:36 EDT 2007 | pjc
Profiling is product specific. An instrument called the OvenRIDER from ECD is for soldering machine quality management. See link below. This instrument measures various parameters of your oven to include thermal transfer efficiency. The concept is,
Electronics Forum | Mon Jun 15 06:21:13 EDT 2020 | ameenullakhan
Hi Team, Main reason for HIP are; 1. Warpage in component or PCB : Verified the part and PCB 1.6 mm thickness no warpage found. 2. Hip was at different locations : center as well as corner : So not because of warpage of component. 3.Solder paste equ
Electronics Forum | Thu Dec 11 09:57:38 EST 1997 | Alan Brewin
Thanks to Scott for your reply, much appreciated. Are you aware of any new developments in this area? Particularly in respect to the solvents? We are aware that fluorine chemistry is now in-use with amazingly high boiling points. We understand that
Electronics Forum | Mon Nov 10 14:26:16 EST 2008 | slthomas
It'll just transfer the load to your compressor, and who knows how efficient your venturi pump (which can also be noisy) will be (IOW, how much load it puts on your compressor is anyone's guess)? I'd just replace or rebuild the vacuum pump, person
Electronics Forum | Wed Sep 19 14:23:31 EDT 2001 | jschake
Pad Metallurgy Used: Copper OSP pads were used for all of the results that I have been reporting. The same design test boards with Nickel/Gold pads are available and awaiting further assembly tests. I will consult with a board technology and metall
Electronics Forum | Mon Aug 25 12:43:35 EDT 2014 | freddimock
Numerous people use the Pyramax oven to process high temp solder but your success will depend upon the mass of your board. To maximize the probability of success you should use the highest convection rate (IWC) possible to enhance heat transfer an
