Electronics Forum: ultrasonic (Page 2 of 50)

choosing the best table top ultrasonic cleaner

Electronics Forum | Thu Sep 15 14:17:00 EDT 2011 | dyoungquist

Check out Zenith Ultrasonics. We have been using one of their table top models to clean our electronic assemblies for several years now.

Baking assemblies after ultrasonic water wash

Electronics Forum | Fri Jun 26 00:28:43 EDT 2009 | Mark

IPA is hydroscopic.

Baking assemblies after ultrasonic water wash

Electronics Forum | Tue Jun 30 13:20:10 EDT 2009 | charliedci

He wants to "see underwater"

Baking assemblies after ultrasonic water wash

Electronics Forum | Thu Jun 11 10:02:36 EDT 2009 | dyoungquist

Our cleaning process involves the assemblies being completely immersed in the water bath of the ultrasonic cleaner. The assembly has a QFP44 on it. Customer stated that when these assemblies have been cleaned with water in the past (at a different

Baking assemblies after ultrasonic water wash

Electronics Forum | Thu Jun 11 22:57:45 EDT 2009 | davef

NASA recommends baking a PCB for a minimum of 4 hours at 93+/- 5.5�C before conformally coating. [NASA-STD-8739.1, �Workmanship Standard for Staking and Conformal Coating of Printed Wiring Boards and Electronic Assemblies,� August 6, 1999]

Baking assemblies after ultrasonic water wash

Electronics Forum | Wed Jun 24 05:08:37 EDT 2009 | Mark

Try immersing the assembly in IPA for 30 minutes. IPA is hydroscopic ans will drive off most of the water. Dry the assembly. Then bake at 110°C for 2 hours.

Baking assemblies after ultrasonic water wash

Electronics Forum | Thu Jun 25 20:01:54 EDT 2009 | davef

Shanelo Technologies Given that isopropyl alcohol [IPA] is produced by combining water and propene. How does soaking a board in water and a flammable liquid drive off water?

Baking assemblies after ultrasonic water wash

Electronics Forum | Wed Jul 01 05:26:31 EDT 2009 | kpm135

But the boards and parts on the boards are also hygroscopic(no not a typo I did a search on hydroscopic and it is not a word the actual word is hygroscopic look it up if you don't believe me) so if you have two hygroscopic materials which one wins?

Baking assemblies after ultrasonic water wash

Electronics Forum | Wed Jun 10 22:47:17 EDT 2009 | davef

You're correct that JEDEC J-STD-033 defines baking condidtions for moisture sensitive components. Why do you want to bake assemblies after cleaning? Search the fine SMTnet Archives for threads like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Me

choosing the best table top ultrasonic cleaner

Electronics Forum | Thu Sep 15 11:20:03 EDT 2011 | cobham1

We are in the process of updating our SMT area and I need to clean my boards. In my research I have found out that if I choose the ultra sonic path I need to make sure the cleaner uses a sweep frequency system in order to protect the SMT parts. Can s


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