Technical Library: universal and instruments and 4

Effect of Morphology of Calcium Carbonate on Toughness Behavior and Thermal Stability of Epoxy-Based Composites

Technical Library | 2020-10-14 14:49:14.0

In this study, the modification of an epoxy matrix with different amounts of cube-like and rod-like CaCO3 nanoparticles was investigated. The effects of variations in the morphology of CaCO3 on the mechanical properties and thermal stability of the CaCO3/epoxy composites were studied. The rod-like CaCO3/epoxy composites (EP-rod) showed a higher degradation temperature (4.5 _C) than neat epoxy. The results showed that the mechanical properties, such as the flexural strength, flexural modulus, and fracture toughness of the epoxy composites with CaCO3 were enhanced by the addition of cube-like and rod-like CaCO3 nanoparticles. Moreover, the mechanical properties of the composites were enhanced by increasing the amount of CaCO3 added but decreased when the filler content reached 2%. The fracture toughness Kic and fracture energy release rate Gic of cube-like and rod-like CaCO3/epoxy composites (0.85/0.74 MPa m1/2 and 318.7/229.5 J m

Inha University

Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift

Technical Library | 2017-09-07 13:56:11.0

As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.

Teledyne DALSA

The Effects of Ergonomic Stressors on Process Tool Maintenance and Utilization

Technical Library | 1999-08-05 10:57:54.0

This study examines ergonomic stressors associated with front-end process tool maintenance, relates them to decreased machine utilization, and proposes solution strategies to reduce their negative impact on productivity.


Overcoming Logistic, Economic and Technical Challenges to Implementing Functional Test in High Mix / High Volume Production Environments

Technical Library | 2012-11-29 14:23:58.0

1000 units per day) production environment presents challenging technical, logistic and cost obstacles that are usually more complex than those encountered at the inspection (automated optical inspection) and the manufacturing process test step (in-circuit test).

SiFO Technologies

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

Technical Library | 2012-06-21 23:06:06.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Most high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products despite the increasing trend for design and conversion


The Relationship Between Energy-Resource Depletion, Climate Change, Health Resources and the Environmental Kuznets Curve: Evidence From the Panel of Selected Developed Countries

Technical Library | 2017-09-13 00:20:21.0

The objective of the study is to examine the relationship between energy-resource depletion, climate change, health resources and the Environmental Kuznets Curve(EKC) under the financial constraint environment in the panel of selected developed countries, over the period of 2000–2013.

Changan University

The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible, High Density Ball Grid Array Assemblies

Technical Library | 2015-01-08 17:26:59.0

Regardless of the accelerating trend for design and conversion to Pb-free manufacturing, many high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products. Certain high reliability electronic products from the telecommunication, military, and medical sectors manufacture using SnPb solder assembly and remain in compliance with the RoHS Directive (restriction on certain hazardous substances) by invoking the European Union Pb-in-solder exemption. Sustaining SnPb manufacturing has become more challenging because the global component supply chain is converting rapidly to Pb-free offerings and has a decreasing motivation to continue producing SnPb product for the low-volume, high reliability end users. Availability of critical, larger SnPb BGA components is a growing concern


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