Electronics Forum | Mon Sep 21 15:45:35 EDT 2009 | boardhouse
Hi Ryan, Standard shelf life for FR4 Non-RoHs & Rohs material with HASL or Lead Free HASL would be 12 months + in a controlled environment. on all RoHs materials over 6 months, we would suggest your board shop run a solder ability test before ship
Electronics Forum | Tue Sep 10 08:01:47 EDT 2002 | mpotter
Kevin If you want to go automated then why not take a look at the Philips ACM. It is the flagship for placing SMT and Oddform packages. We use Vacuum nozzles and Grippers to handle many truly oddform components.
Electronics Forum | Tue May 15 15:15:53 EDT 2001 | ohboy
Hi all, I just discovered this forum and I'm very impressed. We have a vendor who recently stopped placing desiccants in the vacuum packaging for our pcbs. (Yes, it's on the dwg!) His reasoning was that the desiccants can degrade the finish on the
Electronics Forum | Thu Jun 16 16:50:37 EDT 2011 | boardhouse
Hi Milroy, One thing to check is the FR4 Laminate being used - if this is a RoHs build is the correct FR4 being used by your manufacture. What layer count of board are you seeing the delamination on? Does you board shop Vacuum seal the packages wi
Electronics Forum | Wed Jul 17 06:54:17 EDT 2013 | deanm
We manufacture according to military Class 3 standards and we do not vacuum seal any MSD devices. Your current method of dry packing is sufficient as well as dry cabinet or nitrogen storage. A light evacuation of air during the dry packing process
Electronics Forum | Tue Nov 15 22:33:16 EST 2022 | kumarb
Yes, solderbility. I recall one case of a vendor we met at a past HK electronic fair. Pricing was ok, we selected them and ordered a batch of boards. After a few months of leaving the PCBs in a sealed package (vacuum), we attempted to use the PCBs. W
Electronics Forum | Tue Sep 05 10:43:02 EDT 2023 | klauss
I've some special nozzles for melf packaged diodes. When I am trying to mount it on pcb, nozzle picks up the diode and place it well. After 5-6 times of placing, diodes keep drops down to it's package from nozzle. It's like the vacuum doesn't enough
Electronics Forum | Tue May 30 13:50:40 EDT 2006 | Dragan
Hi, I ran into a problem and need a solution. It is a 3cm*4cm*1mm 2 layer PCB (6x6 panel) with a LQFP128 package Microcontroller, a resonator and 2 capacitors. What happens is: When i recieve the assembled pcbs from the assembly plant they wor
Electronics Forum | Tue May 30 17:17:08 EDT 2006 | Dragan
Hi, I ran into a problem and need a solution. It is a 3cm*4cm*1mm 2 layer PCB (6x6 panel) with a LQFP128 package Microcontroller, a resonator and 2 capacitors. What happens is: When i recieve the assembled pcbs from the assembly plant they wor
Electronics Forum | Mon Jan 25 18:15:39 EST 1999 | Joe
Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and re-packed
