Electronics Forum | Fri Apr 27 08:44:08 EDT 2007 | Brett
For those of you who use via holes as test points, and the via holes must be filled at the wave, is it necessary to have a "dome" on every single test point, or is it sufficient to have the via "filled" with solder? The ICT preson here insists that
Electronics Forum | Tue Nov 28 16:28:14 EST 2000 | CAL
Chris- The machines you identified are stable products and have been around for over two years now and most bugs have been worked out. The F5 IC head has not changed much since its introduction over 5 years ago. Remember these machine like to run, r
Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp
Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W
Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane
i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red
Electronics Forum | Tue Mar 04 15:34:31 EST 2003 | ROHAN SARKER
Well very interesting...i think a possible solution can be data acquisition via Matlab and then carrying the necessary operations.Can u give details of your works-----I can then get closer to a possible solution.
Electronics Forum | Thu Jul 08 13:30:02 EDT 2004 | Daan Terstegge
I would be glad to host your paper on http://www.smtinfo.net. You can email me via the link on my site. Daan Terstegge http://www.smtinfo.net
Electronics Forum | Fri Aug 24 08:53:54 EDT 2001 | gerits
Hi, Have a look at following site assembleon.com They have exactly the equipment you're looking for and with the requirements you asking for. In case you want detailed information you can contact me via e-mail or phone (+31 - 40 - 27 66053). I can
Electronics Forum | Tue Aug 12 14:49:26 EDT 2008 | awegener
I'm attempting to pick and place a small rivet onto our PCB. The rivet should be attached via reflow solder. The rivet will be used to create a sandwich, holding together a frame and additional circuit board in a package. This part is intended onl
Electronics Forum | Tue Jan 26 10:47:39 EST 2010 | oeidave
Hi, Thank you for posting your question. Omron Electronics provides both High End AOI and 3D SPI systems. I believe that our S7oo series AOi and VP 5000 or VP 6000 3D SPI systems will meet your needs. Please feel free to contact me via email (david.
Electronics Forum | Wed Mar 02 18:46:02 EST 2005 | Austinj
The tendancy always has been "when in doubt, touch it up"... this is not the way to "verify the process" and is not the best strategy for multiple reasons (unessecary rework, additional labor costs, as well as making the solder joint more brittle, [i
