Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal
Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process
Electronics Forum | Mon Mar 13 16:56:26 EST 2006 | slthomas
He's a troll. Nobody could be that goofy without trying.
Electronics Forum | Wed Mar 08 10:59:04 EST 2006 | samir
Cal, thanks for the feedback. I've tried different adjustments to wave parameters with varying success. You know how wave is - what works today won't necessarily work tomorrow. ..and yes, we run Nitrogen on our waves.
Electronics Forum | Mon Mar 13 06:11:08 EST 2006 | Rob
Surely this is a job for Wavemaster Larry? Have you tried flux buster pins in your ICT yet? They are quite good at cutting through the crap on a board.
Electronics Forum | Mon Mar 13 12:53:21 EST 2006 | slthomas
"Surely this is a job for Wavemaster Larry?" I know this is supposed to be a serious forum, but that's some funny stuff! 8 mil stencils. Suuuuure.
Electronics Forum | Mon Mar 13 15:35:56 EST 2006 | russ
You're a piece of work! Why don't you work for any of the major wave companies? So how does slowing the conveyor speed eliminate drying flux? And when you slow it down, what speeds it up to make you say "I lower the wave because I get shorts going
Electronics Forum | Mon Mar 13 14:26:45 EST 2006 | Wave Master Larry
Well, im not sure what plane you guys are on, but I can back up my what im talking about. Ya see I wnet to Soltec traingin back in 1995 for our new wave. I got a diploma proofing that I know what i'm talking about. no one else in my company has on
Electronics Forum | Tue Mar 03 03:11:57 EST 2015 | vb7007
Hi I also forgot to mention, top side is reflowed first at SMT. Tenting vias is good option. we are looking into it. Can you please also suggest any solution to avoid solder balls at bottom side in other places than vias. Thanks
Electronics Forum | Fri Apr 27 08:44:08 EDT 2007 | Brett
For those of you who use via holes as test points, and the via holes must be filled at the wave, is it necessary to have a "dome" on every single test point, or is it sufficient to have the via "filled" with solder? The ICT preson here insists that
Electronics Forum | Mon Mar 02 23:48:22 EST 2015 | vb7007
Hi We are using Universal carrier for a 2 sided PCB, where the bottom side goes for hand solder the switches after wave. Our issue is, we are getting micro solder balls all over PCB bottom after wave, whereas we got numerous vias, which also turns
