Electronics Forum | Sat Mar 27 08:15:02 EST 2004 | davef
Via in pad is a designer's dream and an assembler's nightmare. Search the fine SMTnet Archives for previous discussions to get started. VIP, via-in-pad, or whatever tend to promote voiding within the via and certainly partially starved solder conne
Electronics Forum | Fri Mar 26 17:12:17 EST 2004 | ben
I have recently encountered a new pcb design with a very high density of components on either side of the pcb. One of the suggested "fixes" is to use the smt pads as vias i.e. the via will be drilled thorough the centre of the smt pad. My concern i
Electronics Forum | Sat Apr 03 05:21:33 EST 2004 | mattkehoe
There is a method for VIP you may not be familiar with. I dont want to go into depth here but check out http://www.sipad.com/sipadvip.htm and contact me off line if you want more info. Good luck. mk
Electronics Forum | C.W |
Sat Jul 31 17:29:18 EDT 2004
Electronics Forum | Tue Aug 03 14:46:25 EDT 2004 | russ
We recommend to the designers "the smallest diameter that you can get away with", that will help reduce the solder scavenging into via diring reflow. unless you are planning on having them filled as Dave F mentioned. Russ
Electronics Forum | Tue Aug 03 08:38:42 EDT 2004 | davef
Conductive epoxy is usually specified as less than 6:1 aspect ratio fill capable, while non-conductives are 10 to 14:1 (depends on which brand and who you ask).
Electronics Forum | Tue Sep 17 00:40:39 EDT 2002 | yngwie
Hi all Experts, Desperately need your help on the following questions on Via in Pad and want to understand each of them wrt : - complete Via in pad - partial encroachment - via partially in pad 1) What is the general feel for via in pad for upcom
Electronics Forum | Thu Nov 01 17:30:55 EST 2001 | davef
Search the fine SMTnet Archives for ... via and pad
Electronics Forum | Tue Sep 17 08:26:28 EDT 2002 | davef
Try: "Increasing Density By Placing Vias In Lands"; Blankenhorn, JC; 'Printed Circuit Design'; 11/98