Electronics Forum | Mon Aug 26 20:33:50 EDT 2002 | davef
Not as such. Generally, people tailor their profiles to produce glam solder connections on their boards. Search the fine SMTnet Archives for discussion on the factors affecting solder reflow recipes. What is the best way to get these PCB made to s
Electronics Forum | Wed Aug 28 18:08:07 EDT 2002 | MikeF
This looks like it may be a good application for an Air-Vac or Wenesco type solder station. It is a solder pot that has a small motor to pump solder up through a chimney. You can put different nozzles on the top of the chimney, so you only apply sold
Electronics Forum | Thu May 17 09:00:51 EDT 2007 | bsteffen
Since your budget is between 25 and 30K I would say you have plenty of options. Electrovert and Vitronics are both good solid machines. Seho is another option. Seho is extremely user frendly and maintenance freindly and easy to profile however, it is
Electronics Forum | Mon Mar 21 19:28:18 EST 2005 | davef
Search the fine SMTnet Archives while you're waiting for others to respond.
Electronics Forum | Mon Mar 21 11:57:08 EST 2005 | lyrtech
Hi, actually, I'm searching for a device to create reflow profiles like DATAPAQ, KIC, MOLE.... because our only one unit is broken... Which one are you using and why? Do you know if someone have a second hand unit to sell?
Electronics Forum | Thu Mar 24 12:33:01 EST 2005 | Dreamsniper
I used KIC before now I'm using MOLE. I recommend KIC. regards,
Electronics Forum | Tue Mar 22 06:08:45 EST 2005 | Grant
Hi, We used to manually profile by comparing logged temp numbers and matching the paste profile. But we got a KIC and it's software was so much better we got a good reduction in rework and we have almost no first run faults now. I would recommend on
Electronics Forum | Fri Aug 27 15:00:42 EDT 2004 | davef
Dr Lee's book mentioned above is very good. Also consider: IPC-7530 - Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)
Electronics Forum | Tue Apr 09 08:44:43 EDT 2002 | davef
Read IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)". There is no advantage in dropping off much faster than 4�C/sec. In fact, you risk fracturing your newly formed solder connections due to board warping
Electronics Forum | Thu Jan 17 22:37:43 EST 2008 | davef
Have you tried waving the board rotated 90* from the normal orientation?
