Electronics Forum | Mon Aug 02 11:44:49 EDT 2004 | jbabson1
If you do wire bond before printing, Photo Stencil (www.photostencil.com)can help you design a stencil with relief on the pwb side for the wirebonding.
Electronics Forum | Sun Nov 06 14:12:07 EST 2005 | Danmens
I am looking for someone very familiar with ASM wire-bonders (AB356) to train us after hours on a temporary basis. You must reside in MA, NH or RI. Send an e-mail if you are interested. dmendoza@mnc.com
Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris
The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi
Electronics Forum | Fri Jan 18 19:02:45 EST 2008 | arun2382
I agree, except you need to be careful with the depth of cut since it may affect the package internal connections (wirebonds) -A
Electronics Forum | Mon Oct 26 07:37:15 EDT 2009 | mysmt
Hi, Is your problem solved? If yes then how? Have you tried Plazma cleaning before wire bonding? BR
Electronics Forum | Mon Nov 02 16:24:01 EST 2009 | cab
Au measured out( using XRF)at 55-75micro-inches. Within spec, per out QA dept.
Electronics Forum | Tue Jan 21 00:44:30 EST 2014 | leardkattiya
Hi All, I have a question to ask. Do we really need ESD kapton tape to be use inside SMT line/ production? Anyway the purpose of the kapton tape is to protect gold finger/ wirebond area from solder splatter. Please advise.
Electronics Forum | Thu Mar 11 13:09:52 EST 2021 | processman
Hello, Hoping for some help, we have Hesse BJ820 wirebond machine and after changing to new spool of wire the wire snaps after first bond. Anyone have any idea ? Wire is in date and no change in machine setup, just change spool of wire.
Electronics Forum | Tue Jul 01 17:38:24 EDT 2003 | jartman
I've faced this several times in the past, and the only real solution is to wirebond before SMT assembly. Everything leaves a residue, and trying to clean a residue off later is basically hopeless. This may require some trickery in your SMT process
Electronics Forum | Fri Jan 03 16:14:37 EST 2003 | Jacques Coderre
Hi Jon, Flip Chip is chosen as an interconnect approach when one needs improved performance (high pin count, high frequency, noise reduction or improved heat dissipation.Another driver is size...Flip Chip greatly reduces the area and therefore is cho
