Electronics Forum | Mon Dec 16 19:05:57 EST 2002 | davidduke
Steve , I agree with all the responses you have received. Randy Villeneuve is absolutly correct in all of his assesments and I would consider him an expert with the process , Gris is correct about adding a "heat sink" to the process complicating pr
Electronics Forum | Tue Dec 10 14:10:38 EST 2002 | Randy Villeneuve
Steve, I wave solder most if not all our boards with selective wave pallets. I did not catch if the solder balls were on top of the board or on the bottom but that will make a difference on what to do to get rid of them. Pallets are good and bad. On
Electronics Forum | Thu Aug 24 12:35:30 EDT 2000 | Wolfgang Busko
The dilemma with this is that the search in the archive is often not that enlighting as someone might hope. Fact is that each new question (and the answers as well) on old topics adds to the archive making it not better. Well, and than look for the r
Electronics Forum | Thu Apr 19 20:01:30 EDT 2012 | eadthem
some things to consider, Is there flux on the board. are there finger prints on the tops of parts. Is the board warped at the V score from reflow Is the board shifting in the machine during inspection. These are the issues we have had with our mir
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Tue Dec 02 08:40:27 EST 2003 | Daniel Werkhoven
Dear Tom, As manufacturer of solder chemicals for the electronic industry we know we can help you out with your problem. To go no clean you most only organise that the chemistry that stays behind on yr PCB will not cause any problem during the life o
Electronics Forum | Fri Feb 28 09:08:03 EST 2003 | davef
Without drilling through the numbers, they're probably correct. Recognize that standard warp / twist specs [IPC-A-610 1.5% for PTH only and 0.75% for SMT] are not going to make it on tech boards. You need to define specific requirements. This warp
Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef
We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats
Electronics Forum | Fri Apr 30 10:42:40 EDT 2021 | oxygensmd
I have a customer who ask close to prototyping jobs with low volume and high-mix components. A regular job have around 5-30 pieces board but have high quantity and many type of components. All the time over 1000 pieces of parts on board from 250-350
