Electronics Forum | Fri Feb 11 14:32:44 EST 2000 | Ashok Dhawan
I am looking for a Masking tape for Gold fingers on a PCB . It should not leave any residue on reflow soldering ( 220 deg c). Currently, I am using Kapton tape with Silicon adhesive. It is leaving minute quantities of residue? The fingers are al
Electronics Forum | Tue Sep 21 04:00:27 EDT 1999 | Wolfgang Busko
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | We use 6 mil lasercut stencils with 15% reduction and th
Electronics Forum | Thu Sep 30 06:47:51 EDT 1999 | park kyung sam
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | we have placed 16 mil components for 3 years. why don't
Electronics Forum | Wed Apr 15 12:02:02 EDT 1998 | Jim Hoxie
| We are looking for some basic mechanical parts to | advance parts in the Tape & Reel Carrier Tape using | a stepmotor. The Carrier Tape we use is as per the | EIA Standards and I imagine there are dozens of | companies that make a sprocket gear t
Electronics Forum | Wed Apr 15 12:01:27 EDT 1998 | Jim Hoxie
| We are looking for some basic mechanical parts to | advance parts in the Tape & Reel Carrier Tape using | a stepmotor. The Carrier Tape we use is as per the | EIA Standards and I imagine there are dozens of | companies that make a sprocket gear t
Electronics Forum | Fri Jan 17 09:38:20 EST 2003 | Grant Petty
Hi, We have a BGA that uses .4mm diameter PCB pads on the BGA itself, however we have decided to use .5mm pads on the PCB, to help paste release from the stencil. Is this a bad thing, having different size pads on the PCB compared to the BGA itself
Electronics Forum | Sat Feb 15 06:40:14 EST 2003 | Hans Koerner, Germany
It is a serius problem with that mulilayer ceramic caps! In automotive applications you have to use 2 in series for one single cap. During depanelizing you create a mechanically wave in the board, so 3.. 4 mm. Best way is not to do such a wrong desig
Electronics Forum | Mon Apr 28 13:58:33 EDT 2003 | jonfox
Just make sure that you have it set up for 2mm advances (unless your parts are on 4mm pitch) also under your machine parameters, you may have to change the offset (Y only) for your trolley to be able to get to the proper pickup position. I used UFP6
Electronics Forum | Wed Jun 18 16:03:03 EDT 2003 | mkehoe
Orrrrr, just buy a small reflow oven, 5K to 7K, and eliminate the paste printing by using solid solder deposition. No shorts, no opens, no cleaning, and no voids. www.sipad.com If you decide to print your own paste later you can invest the extra 30
Electronics Forum | Tue Mar 02 10:19:41 EST 2004 | loz
Hi all, we have recently seen a design that consists off a QFP100, pitch at 25". Also in the centre of this footprint is a FBGA165 footprint, pad size .4mm @ 1mm pitch. We have been informed that we will fit the QFP. I want to remove the BGA pads fr
