Electronics Forum | Tue Sep 07 15:23:20 EDT 2021 | majdi4
1 ) Component is not Rohs : Material analyzes confirm that they contain lead over than < 1000ppm 2 ) upper piston blocked after reflow 3 ) wetting was unstable and slow due to heat transfer will you produce with ??
Electronics Forum | Thu Jun 09 22:52:16 EDT 2022 | cirsol
Thanks for you reply. I ended up finding a CD that contained them. Our S25 has developed an electrical fault. We've had to take it out of service.
Electronics Forum | Mon Nov 06 03:00:03 EST 2023 | roachindignant
The humidity card must reflect the precise level of humidity present in the shipping container. If the reading is less than 10%, then the relative humidity is less than 10%.
Electronics Forum | Fri Nov 05 21:29:56 EST 1999 | chartrain
No matter what type container you use, air in the delivery line will always be a problem. When you pop the lid on a pressurized container, fill it with a liquid and reseal it, air will be present over the liquid. Where do you think it goes?It has to
Electronics Forum | Thu Aug 19 10:50:51 EDT 1999 | John Thorup
| I have a few general ESD tote questions: | | 1) For purposes of transporting within a factory, are tops necessary to the tote containers? | | 2) Are there any other colors beside black that are conductive? | | Thanks, | Mike Demos. Sort of depen
Electronics Forum | Mon Jul 19 05:40:57 EDT 1999 | HERMAN
| | My wavesoldering machine is equipped with Titanium finger. What composition of Titanium alloy used ? Any grade difference, and which is the best grade for long life ? An info or website concerning it. | | Dear Barden, | | Sorry, I am not fami
Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga
| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro
Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce