Electronics Forum | Thu Aug 19 14:06:07 EDT 1999 | Stu Leech
| | | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large sca
Electronics Forum | Thu Aug 19 14:52:13 EDT 1999 | John Thorup
| | | | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large s
Electronics Forum | Fri Dec 17 14:30:42 EST 2004 | Dreamsniper
I goy this issue: Voids in almost every ball of my BGA's prcessed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Fri Dec 17 14:31:52 EST 2004 | Dreamsniper
I got this issue: Voids in almost every ball of my BGA's processed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Fri Jul 17 01:39:07 EDT 2009 | grahamcooper22
Hi, it is not necessary to store MSDs in nitrogen to stop them absorbing moisture, just a dry environment. Nitrogen storage is good for storing devices for many years as it reduces the oxidation of the solderable surfaces. Best option for storing MSD
Electronics Forum | Mon Aug 06 09:55:32 EDT 2012 | dyoungquist
Techspray makes a liquid called "Eco-Stencil SMT Stencil Cleaner" and also pre-saturated wipes by the same name. We spray the cleaner on the stencil and then use the wipes to clean the paste off of the stencil. Putting 1 wipe in each hand and rub
Electronics Forum | Tue Jun 05 16:40:46 EDT 2001 | kerryn
Thanks Phil. However, my objective is to identify stencils that are not 100% clean prior to sending to inventory. I want to catch it before the solder paste has a chance to dry and harden in the apertures. Kerry
Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Fri Mar 09 05:06:09 EST 2012 | grahamcooper22
Is your solder paste deposit drying out? Or if the paste deposit is small or there is insufficient paste then the tack between the device and paste will be poor so it can easily come out of the paste during its placement or placement of other parts.
Electronics Forum | Thu Feb 16 11:42:29 EST 2006 | russ
I use Alpha 857 W.S. for wave is that what you mean? If so, I love this stuff, it solders everything. one downside to it is convection (wave , rework) can dry it out and leave white hazes and even residues at the joints.
