Electronics Forum | Wed Mar 14 09:16:45 EST 2001 | gsmguru
In the past I've removed shields with a dedicated hot air machine. (Similiar to an SRT) This machine could remove and replace shields using a stereo microscope and a positioning system. Basically a special nozzle is designed for each type of shield.
Electronics Forum | Thu Aug 16 23:30:02 EDT 2001 | fastek
Not exactly sure what your specific requirements are but I am in the process of clearing out a major OEM's SMT facility. Lots and lots of general production equipment is available such as stencil carts, production benches (with and without lights and
Electronics Forum | Thu Jul 20 16:45:54 EDT 2000 | Darby
Good morning Bob. Darby from Australia here. We sometimes see an orange peel type finish on our reflow solder joints when viewed under the microscope. Any ideas on what causes this ? Should I worry about it. I use a straight rise profile ( no "platea
Electronics Forum | Wed Sep 12 18:08:15 EDT 2001 | davef
I missed the laundry part [but then again, I couldn't figure-out that "AMT" as THE typo] That aside, I have no problem with what Cyber said. Continuing, we have talked about all of the following issues in previous threads on SMTnet: * LSM 300 does
Electronics Forum | Thu Jul 19 08:00:03 EDT 2001 | doctord
Solder balls or mid chip beads? Remember IPC classification for Class 2 allows mid chip beads encapsulated in flux. Usually on R's and C's first thing I would do is verify .006 laser stencil 10% reduction and the most critical, The paste must be on t
Electronics Forum | Thu Jan 20 02:36:29 EST 2000 | erico
Hi wolfgang,Dave & PC: What I facing are: 1. The component lie flat on the board but only one side can get solder.The pad is ok, problem is with the chip. 2.I desolder the chip and go to view it under microscope and found that there is a line near t
Electronics Forum | Mon Aug 16 09:50:20 EDT 1999 | Earl Moon
| Hello reflow experts, | | I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. | | thanks in advance.... | | ...Omat | | Not really that much with eutectic balls and solder pasted pads and the reflow
Electronics Forum | Wed Aug 12 00:16:43 EDT 1998 | Ron Costa
Hello everyone, I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible solde
Electronics Forum | Mon Aug 10 22:18:02 EDT 1998 | Steve Gregory
I am trying to get an idea of what system seems to work best for >solder paste inspection. I am looking for basic table top >models with he capabilites of height and width measurements. >Can anyone give me suggestions, pricing and why you prefer on
Electronics Forum | Mon Aug 27 09:56:00 EDT 2001 | stefan
I wonder what kind of equipment the board designer had in mind? Are you shure you can do the board with a Mydata ? Where do you put the tray for your 20 mil QFP's? 10 mm thick plus component height also appears to be a problem. Multitroniks can do la
