Electronics Forum | Wed Apr 16 16:55:38 EDT 2003 | russ
Thanks for the info, Here is a couple more questions (and you thought you were done) What size are these caps /res? how thick is your stencil? what type of oven are you using? what is the finish of the board? Anyway, it seems like (from a distance)t
Electronics Forum | Thu Jul 03 12:03:00 EDT 2003 | slthomas
So, there is a crack or gap between: * Solder and component termination. Bingo Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the termination. Unfortunately at 45X I can't rea
Electronics Forum | Tue Jan 30 07:29:21 EST 2018 | charliedci
I believe the correct statement (I've been told) is "the process is no clean". The solder paste is "low residue". As a CM, in the past we had customers that insisted on a wash after soldering. We used DI water with a saponifier which had mixed result
Electronics Forum | Fri Jan 26 12:19:24 EST 2018 | clockwatcher
I'm looking for a No Clean SAC 305 Solder Paste that can be run through our inline wash. No chemicals just DI water.
Electronics Forum | Wed Jan 31 07:37:48 EST 2018 | stephendo
Michael What you say is not a reason for washing. It is a reason to not use Can't Clean solder paste. Although I guess if they use the real name they wouldn't sell as much as they do by calling it No Clean.
Electronics Forum | Thu Feb 01 08:46:54 EST 2018 | charliedci
Your right, he is "selling it". Or I should say he is not selling no-clean solder paste.
Electronics Forum | Fri Dec 13 10:06:05 EST 2013 | davef
For vertical mounted, axial leaded components; the standoff from the land to the component body should be 0.4mm[0.016in] to 1.5mm[0.059in]. Right?
Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef
Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica
Electronics Forum | Thu Apr 17 10:38:02 EDT 2003 | davef
While Russ is correct that a little voiding is OK, your level of voiding [customer complains that the solder surface looks bumpy] doesn't give us the ol' warm and fuzzy about their process control. For background: * Search the fine SMTnet Archives.
Electronics Forum | Thu Apr 17 17:38:57 EDT 2003 | Takfire
Dave, I am not exactly sure what is driving them to believe that this is a capacitor issue. It is unfortunate, that this belief has slowed their activity in further understanding their manufacturing process. The caps are BME (Base Metal Electrode
