Electronics Forum | Mon Feb 22 16:39:33 EST 1999 | C.K.
| | Hi Folks. Has any Process Engineer here done a complete evaluation or controlled experiment for VOC-FREE Flux? Our goal here at CEBUKid, Inc. is to implement a VOC-FREE process. We have all the necessary (OPTIFLUX) spray equipment, and we're c
Electronics Forum | Wed Dec 30 17:20:40 EST 1998 | Marc P.
| Does anyone have angles on how to reduce N2 consumption at reflow process (i.e. process control equipment, etc.)? | | Any help would be appreciated | There are a number of ways to reduce consumption: 1)One way to look at consumption is to view i
Electronics Forum | Wed Aug 04 14:23:06 EDT 1999 | Dave F
| Jim McCarten and Dave F, | | Jim - How about a little explanation on your PlacePro 7100 comments? I'd like to know what a "typical SMT board" is and how "thruput is cut in half" by assembling it. Is this typical SMT board something that most manuf
Electronics Forum | Wed Sep 30 18:43:46 EDT 1998 | Graham Naisbitt
Chrys, Please, refer firsatly to J-STD-001 Appendix D. Now, consider: SIR testing will help define the reliability of your finished assembly - it will not tell you how clean it is. Which do you or your customer prefer? Present SIR testing de
Electronics Forum | Tue Sep 22 12:25:31 EDT 1998 | Chrys
| | Hi Jacqueline! | | Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? | | If that is true, are there many vias concen
Electronics Forum | Mon Sep 14 17:39:37 EDT 1998 | Steve A
| I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the composite surface is bubbling up and glass fibers are also starting to show. | The problem here
Electronics Forum | Tue Sep 15 07:54:42 EDT 1998 | Rob Fischer
| | I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the composite surface is bubbling up and glass fibers are also starting to show. | | The problem h
Electronics Forum | Thu Aug 20 15:29:45 EDT 1998 | D. Lange
Re: Questions #2 Are you having solderability problems with that arrangement? Sounds like problems could be solved at the wave solder. If the customer has already spun pcb then sometimes for low volume it would be easier to correct the problem at wa
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Thu Jun 25 14:33:51 EDT 1998 | Chry
| Hi there Chris! | Are the leads you talking about fine pitch? Is the complete fillet attached to the foot, with it being cleanly separated from the pad? I bet if you look at the board there will be via's really close to the pads at the location
