Electronics Forum: pass (Page 134 of 142)

Re: Conformal Coating that doesn't require fancy equipment...

Electronics Forum | Fri Jul 24 13:04:55 EDT 1998 | Dave F

Hey youse guyz... We're finally getting our first real job at the start-up I'm working at. It's actually a pretty unique little board too. Simple as all get out, but unique. You're not gonna believe what this goes into...guess? (I bet ya' you'll

Re: Wavesoldering Organic Copper Coated Vias

Electronics Forum | Thu Jun 25 14:45:55 EDT 1998 | Chrys

I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold

Re: Providing Thermal Relief On Vias

Electronics Forum | Wed Jun 03 21:25:33 EDT 1998 | John Allan

Hello: BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op

Re: Providing Thermal Relief On Vias

Electronics Forum | Thu Jun 04 08:32:21 EDT 1998 | Dave F

Hello: BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints

Re: Flux splattering during reflow

Electronics Forum | Mon Jan 19 20:01:11 EST 1998 | Steve Gregory

We use no clean paste and sometimes experience flux splattering which gives spot on gold fingers. Need help in analize the cause. thx. Dominic, That is STILL a problem huh? It's a tough one to solve sometimes...especially when you have as

Why is NC the prefer process for BGA mounting? why not WS?

Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef

1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use

Solder Paste Inspection System.

Electronics Forum | Mon Mar 11 13:11:00 EST 2002 | steve_arneson

I have read all of the previous threads and have found it very hard to believe what I am hearing. The idea that AOI is not needed on your production line is like running a marathon without training before hand. You can only expect to get out of an

DPAK land pattern

Electronics Forum | Thu Mar 21 21:21:37 EST 2002 | davef

In the beginning, there was TO-5. And it was good. Flushed with success, they created TO-220. It too was good. Then came SMT. It was better than some things, but then again ... In these early days, there was a haze on the horizon that blocked t

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan

Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op

Help SMTnet with new feature

Electronics Forum | Mon Apr 22 14:21:50 EDT 2002 | bdoyle

Hello Everyone! I'm sure everybody is curious about what we're up to every day. Well in an effort to improve the site for all of our users we're currently working on a pretty big feature. This feature comes as an answer to the countless emails we


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