Electronics Forum: after (Page 137 of 696)

N2 wavesolder

Electronics Forum | Fri Sep 11 06:35:19 EDT 1998 | KME

How can solve the small solder ball after w/s. (oxygen level is 40000~5000ppm, no-clean flux & Tamura N2 w/s machine).

Re: N2 wavesolder

Electronics Forum | Tue Sep 15 10:34:27 EDT 1998 | Larry

| How can solve the small solder ball after w/s. (oxygen level is 40000~5000ppm, no-clean flux & Tamura N2 w/s machine). Post your question in the SMT Forum for a better response. This area is not for tech questions.

v4p895p3/smt v1.0

Electronics Forum | Wed Aug 19 13:25:18 EDT 1998 | Claude Clerc

I'm searching after a documentation about the jumpers of the motherboard v4p895p3/smt v1.0. Do you want to send me one, please ? Thanks Claude Clerc

5 micrograms

Electronics Forum | Fri Aug 14 09:48:43 EDT 1998 | Pat Copeland

Electrical Eng. is looking for 5 micrograms per sq centimeter. After the board has been cleaned. Is this possible on a fully assembled bd?

Misalignment in TBGA?

Electronics Forum | Wed Jul 29 20:18:35 EDT 1998 | Karlin

Hi, I am current facing misalignment issues after reflow on TBGA. Do any one have experience in it? rgs, karlin

speaker

Electronics Forum | Fri Jun 19 01:27:31 EDT 1998 | Mark Chua

Speaker made of ABS material could not withstand temperature of 250 C after wave soldering, please advise what is the guidelines for such material to pass thru wave soldering process, is there any guide books for my reference.

Surface Mount Solder Balling

Electronics Forum | Fri May 29 13:37:18 EDT 1998 | Ryan Jennens

We are getting solder balls after reflow of surface mount components. We are using a no-clean paste and a new jar seemed to help for a little bit. Any ideas? Thanks in advance

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 14:42:55 EDT 1998 | Justin Medernach

| We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.

DI Water Tarnish On Metal Parts

Electronics Forum | Wed May 20 15:10:35 EDT 1998 | Dave F

We notice that DI water seems to tarnish or discolor the metal packaging on crystals and DIN connectors. Our marketing types like the shiney metal surfaces. We don't want to hand solder these parts after washing. Any suggestions? Dave F

Need to spec in smt prototype equipment

Electronics Forum | Wed May 13 16:43:31 EDT 1998 | PAUL OHAMA

Any ideas on what to buy? Only need to build surface mount protos, ability to rework. Is a rework station okay? Will subcontract production after design is proven.


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