Electronics Forum | Thu May 23 22:17:47 EDT 2002 | davef
Not intending to undercut Mike's offer, but to compliment it. Consider asking Heraeus for guidance about cleaning the residues from reflowing your paste. Some NC flux res: * Cannot be cleaned. * Can be cleaned after a relatively short period of tim
Electronics Forum | Tue Jun 04 13:13:58 EDT 2002 | slthomas
Another thing we see is solder balls (sometimes fines, sometimes larger stuff) in the vias after a misprint has been poorly cleaned, as in wiped down but not washed. They end up in the plated through holes too, but those get nicely cleaned up in the
Electronics Forum | Tue Jun 04 15:52:44 EDT 2002 | Hussman69
Closed by solder mask? At any rate, still sounds like wave solder. Take a look before and after wave. That should tell ya.
Electronics Forum | Fri Jun 14 16:51:28 EDT 2002 | nuezmaster
Thanks for all the advise. I was able to recruit one person for a week to inspect boards after pick and place and was able to show a 65% efficiency increase for that line. Now I have a req. for 5 more people. Thanks, Nuez
Electronics Forum | Wed Jun 12 22:35:03 EDT 2002 | jkhiew
We had alot of problem with melf diode short together after reflow soldering. The clearance is about 0.8mm & we used "v" shaped opening . PLease comment !
Electronics Forum | Thu Jun 13 05:46:34 EDT 2002 | jax
After reflow, Are the end terminals of the melf packages touching or is it a paste bridge? What type of reflow are you using? IR?... Convection?
Electronics Forum | Sun Sep 15 21:44:41 EDT 2002 | jason
Hi Dave, Immersion Ag has poor surface appearances after reflow or rather tarnished, while Immersion Tin requries higher temp. Probably that's why Immersion Ag is more preferred.
Electronics Forum | Wed Jun 19 21:29:00 EDT 2002 | redmary
we have a big inventory of over-shelf-life PCB, most of them are stored over 2 years. Could we ensure all these over 2 years PCB will not cause significant quality issue after assembly? and where could I find the related specification?
Electronics Forum | Wed Jul 10 22:32:46 EDT 2002 | redmary
i just find the gap inside the component from the cross-section, it indeed exists the interal crack, not solder joint crack. but why the failed capacitor is well after some time. and the other suspicion is the quality of the component.
Electronics Forum | Fri Jul 26 01:56:28 EDT 2002 | Dreamsniper
Here Downunder, I spoke with few SMT equipt suppliers and they said that many small companies bought machines since after the Sept. 11 incident. Info Tech is really down here but electronics manufacturing is rising at a slow rate but it's still hard
