Electronics Forum | Wed Dec 21 10:00:28 EST 2005 | russ
I'm curious about the "large infrastructure" statement. Do you or anyone believe that the large infrastructure is better? Sometimes, I am not so sure. I actually rate Dynatechs service as some of the best I have had. (No, I do not work for Dynatec
Electronics Forum | Tue Jan 10 14:44:42 EST 2006 | greg york
Not sure about Sn/Cu/Ni large market share here in Europe as we have a large part of the UK market with SACP0307 alloy 0.3%Ag introduced over Two years ago Also worked against Sn/Cu/Ni alloy with large TV Co and they went with 0.3%Ag due to reliabili
Electronics Forum | Thu Aug 24 19:26:07 EDT 2006 | darby
Dave, Cygnal was taken over by Silabs. I based my design on the second link that you provided. Tell me folks, are you using one large pad with only the stencil having the grid, or are you actually breaking up the large pad into grids with mask around
Electronics Forum | Mon Jan 14 22:52:48 EST 2008 | davef
Using larger pads on the corners is fairly common to improve self-alignment of BGA and CSP. For example, "9.3.2.8 Large corner pads and overprint The self-alignment of BGA or CSP can be improved through a design change. By utilizing a large board pad
Electronics Forum | Fri Sep 19 10:20:20 EDT 2008 | mi
I asked the stencil house we go to for quote on 29"x29" & anything larger stencil. Your board size converts to just 16.22"x26.9685". I don't know the next stencil size after 20"x20". Maybe, common is 29"x29"? I also asked about "frameless" stencils
Electronics Forum | Fri May 31 18:56:17 EDT 2013 | hegemon
Thanks to everyone for your answers... > > Delta T > represents the maximum temperature difference > between the hottest and coolest part of the > assembly.........so if we take a profile,the > hottest point would be on the solder pad and the >
Electronics Forum | Tue Feb 04 09:21:48 EST 2020 | nhusa
There are two areas that are important when discussing cooling rate. One is the rate thru the liquidus, where a fast rate produces small grains in the metal and a slow rate results in larger grains. Although smaller grains are stronger normal SM
Electronics Forum | Fri Jun 15 13:43:48 EDT 2007 | realchunks
I do want to run a profile, but they won't give > up the machine long enough for me to run one. > The boards that we are running through the wave > are large boards, with large caps, and large > transformers on it. We're building highend power
Electronics Forum | Fri Aug 04 04:26:31 EDT 2000 | Charles stringer
I am experiencing a problem when soldering down a TO263 package. The device has a large solderable tab (approx 8mm square)on the back and 5 leads. Sometimes the leads are not soldered to the board properly. I am using a metal mask with 9 "windows" of
Electronics Forum | Thu Jul 06 07:40:51 EDT 2000 | Christopher Lampron
SAL, How large is the pad in relation to the solderable area on the component. I have seen similar instances where the heat sink of the component covered almost the entire bottom of the part. If your pad is the same size and the aperture is 1:1, ther
