Electronics Forum | Fri Feb 21 23:07:23 EST 2020 | toki
Hi i would like to know how is YSM20R in terms of CPH and overall performance as i am planing to buy 2 units for our SMT assembly line.This our first setup. It will be a mix production line including speaker, router, power unit etc motherboards. Need
Electronics Forum | Thu Aug 13 18:20:44 EDT 2020 | rgduval
Are you getting the same solder issues on all of the components on the board? Any consistency in the ones that come up with no-solder? Same pins, same orientation, etc? Could be a solderability issue on the component or pads. I hate random issues
Electronics Forum | Mon Feb 28 21:30:34 EST 2022 | emeto
Couple notes here: 1. Try to shoot for 250C peak temperature. 2. Use all your 10 zones in profiling for more accurate profile. You should not reach your highest temp in zone8. Try to reach it in zone 10. 3. Go quicker. Your profile might be too long
Electronics Forum | Thu Feb 10 22:31:11 EST 2000 | Dave F
CK: If you�ve done everything under the sun process-wise at the wave: different fluxes, more heat, less heat, more contact time, and less contact time; and are running out of ideas; let me table some thoughts. � "Don�t mess with Mother Nature."
Electronics Forum | Mon Jun 18 15:42:32 EDT 2001 | Gil Zweig
Transmission x-ray inspection is the technique most people are familiar with. Since materials will absorb or transmit x-rays as a function of their atomic number and thickness, the transmission x-ray image provides a two dimensional represenation of
Electronics Forum | Thu Aug 12 17:15:56 EDT 1999 | Jim Blankenhorn
| I am currently involved with designing a pcb which will use 225 pin bga,s | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | use the middle 6 or 7 rows of balls as the ground
Electronics Forum | Fri Aug 13 04:12:41 EDT 1999 | ray hare
| | I am currently involved with designing a pcb which will use 225 pin bga,s | | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | | use the middle 6 or 7 rows of balls as the
Electronics Forum | Mon Sep 21 08:14:14 EDT 1998 | Steve Gregory
| Hello: | I would like to know what causes tombstombing and how can it be prevented? | Thx. | Nichol Hi Nichol! A tombstone happens when solder doesn't wet equally on both terminations during reflow...now why that happens can be found by looking at
Electronics Forum | Tue Sep 01 20:36:05 EDT 1998 | Rin Or
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Tue Sep 01 19:31:36 EDT 1998 | Kallol Chakraborty
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce