Industry News | 2010-04-12 17:20:44.0
Universal Instruments has bolstered its Dimensions line software suite with the introduction of Linechart™ – a performance-monitoring software module designed to increase utilization rates to over 90%. This new multi-vendor reporting software provides complete visibility into all production lines and quickly identifies factory inefficiencies.
Industry News | 2012-04-18 18:34:11.0
Universal Instruments will launch the premier pick-and-place solution for the growing solid-state lighting market with the introduction of the Advantis® AC-60 LED Platform at the NEPCON tradeshow in Shanghai, China, April 25–27. The Advantis AC-60 LED features focused yet flexible performance, maximizing productivity for both LED and surface mount applications by leveraging Universal’s proven Lightning® placement head.
Industry News | 2010-05-20 15:25:16.0
Draper Laboratory, Cambridge, Massachusetts – a research and development laboratory engaged in a broad array of programs for government and commercial sponsors – has selected Universal Instruments’ newly released GenesisSC Platform to be utilized in a wide range of assembly requirements.
Industry News | 2012-02-23 16:51:16.0
Universal Instruments sets a higher standard for versatility and performance in a multifunction surface mount platform with the introduction of the Genesis GX-37D to the Americas market at the APEX 2012. Universal will demonstrate the exceptional capabilities of the GX-37D on booth #2737, as well as share the company’s vision into the exciting new markets shaping the industry landscape and Universal’s unique position as a productivity and profitability leader in these markets.
Industry News | 2013-12-02 14:08:58.0
Universal Instruments' FuzionXC2-37™ Platform was presented the Global SMT & Packaging Global Technology Award at Productronica 2013 as the top machine in the "Placement Equipment - Low/Medium-Volume" category.
Industry News | 2010-03-30 16:26:27.0
AUBURN, Maine — March 23, 2010 — Consistently printing clear and crisp labels requires the proper cleaning maintenance of any thermal printer. KICTeam's introduction of the Seiko Instruments Smart Label Printer Cleaning Card which features Waffletechnology will maintain that clarity on Seiko Instruments thermal printers. This new product was designed specifically for the SLP family of thermal printers through a joint effort of Seiko Instruments USA, Inc. and KICTeam. This new cleaning card is a quick and almost effortless means of removing any leftover adhesive residue or paper dust that can deteriorate the legibility of the print.
Industry News | 2011-06-22 00:38:04.0
Universal Instruments announces an unprecedented upgrade path for its customers to enhance the performance of their surface mount platform feeders. The offer features two distinct options for improving feeder functionality to maximize machine and production line efficiency: a Gold Feeder Remanufacture Program, and a “Green-for-Gold Plus” Feeder Recycle Program.
Industry News | 2013-08-07 13:16:08.0
Panasonic Factory Solutions Company of America today announced the assignment of Brent A. Fischthal as Senior Manager of Product and Solutions Marketing. In this new capacity, Brent will create and implement unified messaging enveloping the award-winning total solutions for “any mix, any volume” that Panasonic offers for equipment, software, and technical services.
Industry News | 2008-07-24 18:43:34.0
Catalyst Manufacturing Services, a full-service contract electronics manufacturer providing engineering, manufacturing, and technical support, has purchased six turn-key production lines from Universal Instruments, including screen printers, reflow ovens and 12 Genesis Platforms, to be installed over their three manufacturing sites located in Endicott, NY (USA), Raleigh, NC (USA), and Tijuana, Mexico.
Industry News | 2010-07-29 15:10:06.0
Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.
