Electronics Forum | Fri May 14 17:09:43 EDT 2004 | russ
pete, you forgot the board flipper and the same line duplicated again for two sided boards! and how about an Xray machine after each oven in case the flying probe cannot test all lines?
Electronics Forum | Tue May 11 10:43:37 EDT 2004 | Melissa
Has anyone experienced problems lately with excess flux residue left on the board after reflow when using Alpha UP78 OSP paste? We are getting a component failure that the designers are blaming on too much residue. Thanks
Electronics Forum | Mon Jun 14 11:16:53 EDT 2004 | Mark
I would say start at the fujiamerica.com website and sign up for support. After you do this (its free) there are manuals on adjusting and forming programs.
Electronics Forum | Mon Jun 14 16:49:08 EDT 2004 | Dreamsniper
Can I manually tin them with solder specially the BGA's. Will that improve the solderability? What about corrosion of the copper? will it be prevented with the above process considering that after tinning of solder the solderability became acceptable
Electronics Forum | Sun Jun 27 02:23:52 EDT 2004 | mskler
Yes,immediatly means after three days of the SMT production.Actually we are using o clean heraeus Solder paste with 2%AG. The contamination is 90.5%.We are not using any extra flux.
Electronics Forum | Mon Jun 28 09:15:21 EDT 2004 | jdumont
Morning all, we have been seeing some problems with the edges of some of our BGA's curling away from the PCB after reflow. Is this possibly a moisture problem? If so what would be a good time/temp to bake them at to rectify the problem? Thanks in
Electronics Forum | Tue Jul 13 07:19:56 EDT 2004 | pjc
The Sentry 2000 does not have its own board handling system. It fits over an existing conveyor in your line right after the printer. You can have the conveyor R-L or L-R.
Electronics Forum | Tue Jul 27 13:48:45 EDT 2004 | Ralf
Hi Recently i have noticed that after reflow (hot air oven) on the solder lands without components but with solder(screen printing) there is discoloration. It looks like gasolin spilled on the wet road (rainbow). Any idea and reason Ralf
Electronics Forum | Mon Aug 23 05:00:20 EDT 2004 | Jefflee
Hi, Would like to know if the design of the Bga pad is depth and after used solder wick and soldering iron to remove the the damage solder ball,there are still remaining solder inside the pad.Is there any method to remove the remaining solder. Thank
Electronics Forum | Wed Sep 01 09:28:20 EDT 2004 | Phil
Ozzy, it is a 1uf cap, not a .1. The 5 indicates 5 zeros after the 1. The MAX-232ACPE uses .1 uf caps. You indicated that it was not the "A" version. phil.hopkins@apcc.com
