Electronics Forum | Fri Apr 24 15:21:08 EDT 1998 | Earl Moon
| Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time | Your help is appreciated | Ed Holton |
Electronics Forum | Mon Feb 23 13:27:30 EST 1998 | Doug Romm
Gary, I'm pretty much the main contact at TI for palladium lead finish questions. We have a web site at "http://www.ti.com/sc/docs/asl/palladm/index.htm" which has technical papers I have written on the subject. Also, you'll find the Pd Lead Finish
Electronics Forum | Fri Jan 30 16:07:45 EST 1998 | Srik Maganti
We are in process of building a product which is a double sided board ( SMT ) and PTH ( topside ). This particular product has a BGA on the topside of the board, which has a kind of plated top on the die. I have heard some companies have had a probl
Electronics Forum | Tue Aug 14 23:58:19 EDT 2001 | Glen Brian
We are using the new auto-dipping machine for LED solder dipping and dragging. The flux is water-soluble flux and the solder is 63/37 at 250 deg. C. Two weeks ago we exchanged the pot with new 63/37 solder. About a week, we found that the high level
Electronics Forum | Thu Aug 16 13:46:06 EDT 2001 | Hussman
Hi Pavel, I'll bet you're talking after reflow - so in a nutshell - it is too much solder. Paste goes under the R or C and rests on the mask after placement. During reflow, this excess paste balls up along your part (wow, look Ma, no rocket scienc
Electronics Forum | Mon Sep 17 02:56:40 EDT 2001 | mugen
Hi, (me been absent for some time...) Are your brds confirmed HAL over copper? (check out what Dave F mentioned abt possible root causes) or are the brds HAL over nickle? (shd be no problem here, if so?) or are the brds strictly nickle plated pads?
Electronics Forum | Tue Sep 18 13:21:06 EDT 2001 | fcouture
Hello Jeff, I found some good information from what I read until now...so thank you! I have two questions: 1) What finish did you use on the PCB for 0201 ? I think with an aperture so small (12x15mils) tin plated is impossible, what do you think
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Fri Oct 05 18:59:53 EDT 2001 | Dan Steffler
I have had an issue where solder has contaminated gold plated pads (fingers) where it is not acceptable. The pads must remain perfectly coplaniar for a LCD zebra strip to lay accross them. Does anyone know of a way to remove the marriage level of s
Electronics Forum | Thu Oct 25 21:04:18 EDT 2001 | davef
You are correct. So, the unit amount of gold [based on IG plating thickness, size of the pad, etc.] dissolves in the solder very quickly. When the solder is liquid for: * A long time, the gold disperses more. * A short time, the gold concentrates a