Electronics Forum | Sat Aug 17 07:48:43 EDT 2002 | bentzen
Hi Brandon. You should always try to optimize / "balance" your line in a way so the machine with the shortest time per placement is your bottleneck. The other machines in the line should then have a 10 - 20 sec sorter cycle time, to be able to cope
Electronics Forum | Fri Nov 08 09:24:16 EST 2002 | rspoerri
Hi, I'm setting up an new production line for cell phone manufacturing and am looking for a second printer for the back half of the line. I am looking at both new and used though used is looking pretty attractive due to the glut of equipment curren
Electronics Forum | Fri May 09 10:44:41 EDT 2003 | gregp
"Point of use" could be your common high runner parts. They are sometimes kept next to the machines (at the point of use) and may be categorized seperately from the rest of the inventory. In your case all of your parts are inventoried next to the m
Electronics Forum | Fri May 09 11:09:47 EDT 2003 | k_h
Each machine has two feeder tables, one is fixed, the other interchangable. Parts on both sides of the machines does not create a kitting problem but can be inconvenient for feeder replenishment. I have found "U" shaped lines to be much more operator
Electronics Forum | Wed Jun 04 18:57:37 EDT 2003 | Rivkin
Hi Guys, How do you calculate throughput? and what's the standard allowance for some hidden downtimes like pick-up miss, pick-up errors, parts/feeder replenishment etc. say i have 4 machines that are not properly balanced in tact time: A= 3 mins
Electronics Forum | Fri Mar 05 06:50:58 EST 2004 | t_white
Does any one out there have any experience with this machine? If you do, what are some pro's and con's associated with it? There are not to many of these installed in the U.S. so hopefully someone across the pond can give me some feedback. BTW...W
Electronics Forum | Wed Jan 12 10:15:43 EST 2005 | davef
We conformal coat our boards and get pretty good coverage along the edges of BGA. If you need coverage along the edges and are not getting it, your supplier may be able to recommend a different material or application method. Most often, underfill
Electronics Forum | Wed Feb 02 11:10:07 EST 2005 | jdengler
Hi AJ, I've never used the Flexa due to the price. We replaced our MCS with eSMT Software (web site http://www.esmt-software.com/). You might want to look at this if you don't need all of the Flexa features. We have older Fuji equipment (GSP's
Electronics Forum | Mon Mar 07 21:37:42 EST 2005 | ABHI
It depends on your product requirements. I have seen aluminium wire bonding operations in as high as class 100K clean rooms. These are the assembly areas for calculators. The best is class 10K clean room for wire bonding. You can go upto fine pitch w
Electronics Forum | Sun Apr 24 09:12:00 EDT 2005 | davef
We're not sure what your customer is talking about either. Gold and tin form an intermetallic compound [IMC] that can cause poor solder connections. To minimize the potential of a problem, keep gold to less than 3 percent of the metal. [Search the
