Electronics Forum: plating (Page 155 of 260)

soft gold vs immersion gold

Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef

90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125

Process & Preparation in using Lead Free Solder

Electronics Forum | Sat Aug 14 21:31:31 EDT 2004 | Daveylau

I'm currently working in a SMT factory in China. I'd like to know what preparation that I would need to change from leaded to lead free soldering. 1.Starting with the PCB production, things that I need to concern about are solder mask, Cu protection

Plating thickness

Electronics Forum | Tue Aug 17 17:06:43 EDT 2004 | davef

First, we'd like to see your supplier's minimum Sn thickness to be increased to 10um. Look here for support of this position: http://www.psma.com/HTML/FILES/forums/leadfree/hp_ext_pos_sn_for_pbfree.pdf Second, increasing the thickness of tin: * Ra

lead free platings and tin lead

Electronics Forum | Tue Aug 31 19:50:44 EDT 2004 | davef

To take our turn at keeping everyone else on the straight and narrow. For more on lead contamination of no-lead solder, look here: http://www.aimsolder.com/techarticles/Lead%20Contamination%20in%20Lead-Free%20Electronics%20Assembly.pdf [We apolog

Wavesoldering Defect

Electronics Forum | Wed Sep 15 05:15:24 EDT 2004 | Adam

I have chceked the fluxing application, I seem to be getting good consistent coverage across the board using our foam fluxing system. Good flux penetration on the top-side of the through-hole plating, as this was checked using a fax paper.There is no

Open BGA joint

Electronics Forum | Fri Sep 17 23:19:07 EDT 2004 | KEN

What is the component ball co-planarity spec? I have encountered many ceramic and ASIC devices that specify 7 mil max. If your stencil is 4, 5, 6 mil you WILL eventually have an open joint. You must deposit solder greater than or equal to your cop

AuSn Alloy Solder Electroplating

Electronics Forum | Fri Oct 01 18:07:46 EDT 2004 | Bryan Smith

Hello Dave, Yes, this is a patented commercial process in our MEMS Foundry and we are already working with several customers. I posted my question because we only recently have started widely promoting our AuSn plating services and we're still grasp

Lead free component problem for VCO

Electronics Forum | Wed Nov 10 20:32:59 EST 2004 | Fengang

Hi Dave, Thanks for your reply. I have checked the former thread you gave to me. But I think it's totally not the same thing. I want to know, when we see the component spec -- 260 centigrade 10secs, the 260 centigrade means what? It's the environme

Manufacturers of

Electronics Forum | Wed Dec 01 19:21:15 EST 2004 | cmiller

You can make one out of a stainless steel tank pretty easy. Cost maybe $1000.00. You will need some hot plate type heaters and some copper tubing with a water flow source to keep the vapor down in the tank. We used two fluid types so one blanketed t

DEK/Tannlin Vectorguard stencils

Electronics Forum | Wed Dec 15 20:17:48 EST 2004 | cmiller

We have switched from IIT pro-plates to QTS stencils. lots of companies provide them. We still buy from IIT, they have been one of the best suppliers we have had. The single axes tightening just does not get it anymore with the super small parts we h


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