Electronics Forum: stencil (Page 155 of 541)

better Stencil Cleaner?

Electronics Forum | Fri Oct 23 12:48:08 EDT 2015 | pjchonis

WE offer Kolb MultiEx N7, a broadband pH neutral cleaning solution that can be used in an ultrasonic cleaner (Concentrate dilution ratio of 1:6). The MultiEx N7 is rated for cleaning solder paste, flux, colophonium and suited for stencils, PCBs, and

Best Jet Printer? MY600?

Electronics Forum | Thu Jan 28 09:21:48 EST 2016 | cyber_wolf

I would challenge anyone to present a legitimate cost justification on one of these machines that was not related to a very specific product/project. In other words I want to see what the advantage is $$ wise purchasing this machine over a screen pr

What will be the effect of additional solder paste?

Electronics Forum | Tue Apr 19 13:23:33 EDT 2016 | vchauhan

We are using Vicor SMT J-Lead VI Chip which is big component on the bottom side. The manufacturer recommends to have 6 mil stencil but the customer required 10 mil stencil. The PWB has gold contacts on both sides. We noticed some mini solder splashes

gas to extend allowed print-to-place time?

Electronics Forum | Tue May 03 23:27:03 EDT 2016 | adamjs

I've successfully refrigerated a pasted board, and placed/reflowed it the next day with minimal issues. Me too. I'm looking for more than one day. > You might want to invest in a stencil cleaner Tried that. They do not work on the high-aspect ra

Solder balling under passives

Electronics Forum | Mon Sep 19 09:16:24 EDT 2016 | markhoch

Hi Shriram, Are you saying that there is a trace running between the pads for this 0603 capacitor? If so, this design may be causing a gasketing issue between the stencil and the PCB. The uneven height prevents the stencil from sitting flat on the PC

SMT Stencil Design

Electronics Forum | Fri Feb 16 03:11:35 EST 2018 | robl

Hi Ameen, Have you tried talking to your local stencil fabricator? they tend to have rule sets built up over years of experience. We are very lucky in the UK to have excellent, very knowledgeable suppliers. Also, stencil design rules are built in

Stencil-less printing?

Electronics Forum | Thu Mar 01 17:45:26 EST 2018 | spoiltforchoice

However the OP is talking about a machine that replaces a placement nozzle with a dispense head. This is a $20k upgrade that runs at a fraction of the speed an inline stencil printer or Mycronic dedicated dispensing machine. Essemtec offer a similar

Stencil life

Electronics Forum | Wed Aug 22 10:28:19 EDT 2018 | buckcho

I have the same machines, haven't figured it out yet. Only idea i got is to scan every batch and get a rough number of the prints. For example if you have an order of 500 panels, usually it would take 500prints to produce them (maybe 4-5 differences

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Thu Sep 06 05:25:38 EDT 2018 | spoiltforchoice

I'm no expert but I think you will find the majority of discussions around BGA & good printing results focus on the PCB design and things like tented vias and pad definition. e.g https://macrofab.com/blog/bga-pad-creation-smd-nsmd/ After that, work

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Thu Sep 06 22:49:35 EDT 2018 | cmchoue

Dear davef, All of this are takling about how to improve release solder paste, Area ratio, aspect ratio...etc, but i want to learn the "When design BGA stencil which the safe air gap between solder paste in difference stencil thickness", this can he

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