Electronics Forum | Thu Oct 04 00:10:15 EDT 2018 | gaintstar
flason smt wave soldering machine: http://www.flason-smt.com/product/SMT-stencil-printer-Dek-Y-Axis-Motor-133128.html http://www.flason-smt.com/product/SMT-stencil-printer-spare-parts-Dek-Camera-181054.html http://www.flason-smt.com/product/SMT-stenc
Electronics Forum | Fri Aug 13 13:50:53 EDT 1999 | Brian Wycoff
| | | | | | Hello | | | | | | | | | | | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | | | | | | 100 du
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Fri Mar 23 14:13:20 EST 2001 | mnaddra
RW, I have Screened Adhesive on to several different assemblies and have found that when it is possible I get a much better result than with a dot deposition process (The green strength was greatly improved), the biggest issue I ran in to was the pr
Electronics Forum | Tue Mar 27 15:53:13 EST 2001 | johnw
RW, I've been printing glue by stencil for a while. Like the other guy's say there are various method's and material's that you can use but then your printing paste so the ideal is for as little change as possible to the method's your already using.
Electronics Forum | Tue Mar 27 15:53:14 EST 2001 | johnw
RW, I've been printing glue by stencil for a while. Like the other guy's say there are various method's and material's that you can use but then your printing paste so the ideal is for as little change as possible to the method's your already using.
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
Electronics Forum | Thu Jan 13 14:16:32 EST 2000 | mike d
Michael, Good afternoon. My experience with the frameless stencils has been less than optimal. I tried the universal stencil system about a year ago and these are my experiences. 1) The stencil manufacturer supplied me with a free frame to try ou
Electronics Forum | Tue Oct 12 22:22:34 EDT 1999 | se
| Hi, | We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: | | 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? | 2- Is anybody using
Electronics Forum | Thu Aug 12 20:31:57 EDT 1999 | Kelly Morris
| | Hello | | | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | | 100 durometer blade. Getting "tails" o
