Electronics Forum | Wed Jan 31 17:45:37 EST 2001 | dason_c
Hi! William, please check the new IPC-A-610 Rev C, para 12.4.10 for the soldeirng anomalies. Most of them may consider as process indicator and not the defect. The most common method to elimate the solder ball is to reduce the solder volume by red
Electronics Forum | Fri Mar 02 12:46:32 EST 2001 | billschreiber
Hi Dale, Care should be taken when using compressed air to dry a stencil. Just as high-pressure sprays can bend delicate land mass areas between fine-pitch apertures, so can high-pressure air. In addition, OSHA frowns on the use of high-pressuer a
Electronics Forum | Wed Mar 28 00:20:48 EST 2001 | chinaren
we use the screen glue AMICON D125 F5 from Emerson company of Belgium and stencil is Varidot stencil from Loctite with thickness of 250 micrometers The squeegee is also from loctite, previously we use squeegee of material PU, it is easy to be broke
Electronics Forum | Thu Mar 29 02:14:07 EST 2001 | peterson
AOI technology is over-priced and inconsistent...lots of false errors. Your best bet is a paste height measuring device (3-D) Cyberscope makes one for 25-30 thousand. This process is really only necessary for high volume operations. As for you questi
Electronics Forum | Mon Apr 09 20:13:01 EDT 2001 | davef
First, some people wait a lifetime for ... ;-) Second, how do you guys measure the stencil aperture clog? What do you think of the Magnaplancil from Fendelaz? It�s a double fyv-blue-green CO2 laser refract-defractometer. ;-) Third, do you really
Electronics Forum | Tue Apr 17 18:11:48 EDT 2001 | billschreiber
Adam, After a thorough cleaning, I see most of my customers using a weekly maintenance schedule. However, because the characteristics of the post solder flux will contaminate the wash solution of the stencil cleaner, some customers wait until they a
Electronics Forum | Fri May 11 10:33:22 EDT 2001 | wbu
Hi KP, I�m wondering why you send those boards outhouse for the SMD part with a stencil. How do you know it fits their printer. We give the stencil data 1:1 to the subcon so that they can order the stencil to their needs with reduction and thicknes
Electronics Forum | Wed May 30 21:16:05 EDT 2001 | davef
MPM AP-27 preferred over MPM AP-20 The issue is release of paste from the stencil. A vertical lift printer kinda snaps the stencil away from the board to complete the print cycle. The inertia and the rheometric properties of the paste make it rele
Electronics Forum | Mon Jul 30 21:12:32 EDT 2001 | davef
"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment: Stencil is too thick. Specifically, a 6 thou stencil should be OK, providing you don�t violate the area and aspect ratios in the fi
Electronics Forum | Thu Jan 20 15:47:39 EST 2000 | Kris W
Rob, I am currently using a BGA-3000 from OK, which works fairly well. I did find that the customer support for the purchase of nozzles and stencils was very poor (overpriced and long lead times). I did find stencils for a good price through Mini
