Electronics Forum: plating (Page 159 of 260)

Solder joint issue

Electronics Forum | Thu May 18 11:27:36 EDT 2006 | patrickbruneel

I'm not on the production floor on a daily basis like the other guys here but here's my 2 cents: With a Ni/Au plating the inter-metallic that needs to be formed is Ni/Sn. Ni/Sn inter-metallic requires higher peak assembly temperature and a longer dwe

Tin Whisker Formation?

Electronics Forum | Fri May 26 14:15:16 EDT 2006 | patrickbruneel

Its it possible to post a picture from right after reflow? To see what we start with and compare the difference after 5 years. The grainy structure is not as much a concern as the growth-like appearance on the boundary of the solder. What paste al

Gold Thickness

Electronics Forum | Fri Jun 09 10:04:16 EDT 2006 | Rob

I know it's friday afternoon, and it's actually hot for once in this country, so my brain may not be working properly here, but isn't 30 micro inches of gold about 0.75 Microns? So that's dead in the middle for gold plating thickness (like gold finge

Gold Thickness

Electronics Forum | Mon Jun 12 10:07:08 EDT 2006 | mkehoe@sipad.net

Can someone look this over and see if this helps?? ****************************************************** I read the e-mail threads and I think the respondents are all mixed up on the units of measure. the print reads: Gold Plate (80 mocroinches m

Imm Silver and Voiding

Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN

We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer

Intrusive reflow component selection

Electronics Forum | Mon Jul 10 04:16:03 EDT 2006 | dougs

Hi, We have a new product coming soon that has a fair number of PTH sockets and headers. I was thinking that it would be good to use intrusive reflow on some of them to even up cycle times between SMT and hand insertion, however, when i called t

pcb manufacturing

Electronics Forum | Fri Jul 28 19:55:31 EDT 2006 | scott

I would agree for a bare board house, are you NUTS? Look what happend to McCurdey's high tech line in S. Cal., go chewed up and spit out by China... Plating, etching, environmental issues, regulations, lack of people who like doing that work... endle

Flying Probe

Electronics Forum | Sat Jul 29 13:30:17 EDT 2006 | Chunks

Some have a bottom side adaptor plates with pins to make contact to certain areas of your board. The top side may have one or multiple heads that can move the entire area of your board. On each of these haeds is a pin like that from an ICT machine.

Solder Ball After Reflow Process

Electronics Forum | Wed Aug 16 13:29:51 EDT 2006 | SWAG

Is 811 lead paste? If so, it seems to me that your oven settings are getting into soak awful fast in zone 2 and your peak is way high. Unless you are doing a thick board or something like that, those oven settings seem aggressive and might result i

Counterbore raw board

Electronics Forum | Thu Aug 17 09:24:28 EDT 2006 | markb

We are looking to possibly counterbore a coule of thru holes in one of our PCBs. We would counterbore the top side, and the only trace is coming out of the bottom side. The reason is to mount some LEDs flush with the board. They have some flash wh


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