Electronics Forum: saponifiers (Page 17 of 19)

Cleaning after rework, no clean flux

Electronics Forum | Wed Feb 26 23:59:48 EST 2003 | Mike Konrad

Grant, No-Clean paste + IPA = White Residue! #1: Stop using IPA #2: Switch to either a solvent-based de-fluxing chemical or an aqueous-based de-fluxing chemical. If you are using an ultrasonic cleaner for your boards as stated, do not use sapon

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 11:40:41 EDT 1999 | Debbie Alavezos

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

Re: Batch Cleaners

Electronics Forum | Tue Dec 08 18:40:04 EST 1998 | Graham Naisbitt

Hi all, Only observation I would make is that it depends upon what you term as clean? Now isn't that an old thorny question. Care to comment? Regards Graham | Hey there Dave! | | We used to use a batch cleaner when we used water-clean paste.

Re: help help! Water clean for CSP/BGA package

Electronics Forum | Tue Oct 05 06:03:37 EDT 1999 | Graham Naisbitt

| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl

More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin

| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

Re: Wave solder edge covers

Electronics Forum | Thu Jul 01 14:47:10 EDT 1999 | Tony

| | | My guess would be trapped flux continuing to be active after soldering. Is the tarnish there immediately after exiting the machine? Do you remove the mask and wash right away? If the solder is reflowing under the mask on the component side

Re: Opinions on in-line wash equipment?

Electronics Forum | Tue Jun 22 13:29:29 EDT 1999 | Deon Nungaray

| We're a CM doing low volume/high mix and are considering buying from one of the two big names, TR** or Sp*******/El*********. We need saponified wash for some of our no-clean over wave; the great majority is OA from our SMT lines. Any thoughts? |

Saponifier needed to stop

Electronics Forum | Mon Oct 08 22:43:13 EDT 2001 | caldon

No wizard here just a troll....Sorry I can not spout a Fountain of information Like "The Dave F" but here is an additive..... Having worked at a Lab for testing Soaponifiers, cleanliness, and contamination when a customer says "we had a lab check it

Solderball Removal

Electronics Forum | Thu May 23 22:17:47 EDT 2002 | davef

Not intending to undercut Mike's offer, but to compliment it. Consider asking Heraeus for guidance about cleaning the residues from reflowing your paste. Some NC flux res: * Cannot be cleaned. * Can be cleaned after a relatively short period of tim


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