SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y
SMTnet Express, December 7, 2016, Subscribers: 27,507, Companies: 15,035, Users: 41,441 Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling Katherine Wilkerson, Ian J. Wilding, Michael Carter, Daniel Buckland
SCAVENGING Scavenging Scavenging, Site Dressing, Residual Solder Removal. What's in a name? "That which we call an onion, by any other name would smell as strong" (apologies to the immortal bard). And, regardless of the name you give it
SMTnet Express, August 24, 2017, Subscribers: 30,744, Companies: 10,648, Users: 23,699 Development of Halogen Free, Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer Dr. Lawino Kagumba - FRX Polymers Inc. ., Yang Zhong Qiang
