Electronics Forum: ipca610 (Page 17 of 22)

bulk feeding chips

Electronics Forum | Wed Feb 26 17:05:42 EST 2003 | davef

Q1: Are the markings on resistors the actual value? A1: Generally, resistor marking indicates the value of the device, where the first two digits are the value and the third digit is the multiplier. Q2: Do AOI machines look for these markings or do

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Fri Mar 07 05:36:21 EST 2003 | O' Connor

Hi Again, In answer to DaveF - Yes solder is fine where the solder paste is deposited , but the part of the pad visible after pasting is still visible after reflow. Previously the solder paste & all the gold diffused & flowed giving a complete silve

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 14:46:29 EST 2004 | dramos1

Hi Russ, Thanks for the reply. In IPC-A-610 Rev. C on section 5.2.9 {Mounting - Connectors] page 5-21 on the manual [January 2000], the acceptable class [1,2,3]listed 3 items. In order for the connector to be accepted, are all 3 items must be met? I

PCB Warpage

Electronics Forum | Thu Apr 07 20:16:23 EDT 2005 | davef

Q1) Simple way to measure the PCB warpage A1) IPC-TM-650; Method 2.4.22 Bow & Twist Q2) What is the maximum warpage can the SMT machine allow the to accept and place the component without problem. A2) That depends. IPC-A-610 Acceptability of Elect

how clean is clean?

Electronics Forum | Fri May 27 17:21:35 EDT 2005 | mrclean

Dear SM Rookies, Another acceptable test method is visual inspection. IPC-A-610 details what to look for with different contaminants, providing magnified pictures of the possible visual residues. With an existing cleaning process, magnification

Reliability assessment SnPb joints to lead-free component

Electronics Forum | Thu Jun 09 05:04:05 EDT 2005 | Joseph

Dear Patrick, Unfortunately we do not know what exactly the failure as our customer refuse to reveal to us. From visual inspection the solder joints are smooth and shiny as per IPC-A-610 requirements. The component supplier (IR) commended that they

Probing Vias

Electronics Forum | Wed Jul 20 15:05:28 EDT 2005 | Fred M.

With the new rev D release of IPC-A_610 came a new section 10.2.9.3 which identifies a via (through hole) with nicks along the inside of the annular ring. Defect is all three classes and states "Damage to conductor or lands". We have for years defa

cleaning spec

Electronics Forum | Wed Mar 08 14:11:38 EST 2006 | mholz

I am looking for an industry standard �stock� note to place on our printed circuit board assembly drawings that will capture a level of cleanliness for an IPC-A-610 class 2 board assembly. I�m looking for some quantitative spec for cleanliness that w

Fillet Tearing

Electronics Forum | Wed Mar 22 01:24:54 EST 2006 | Joseph

Dear all, Referring technical report from Vitronics Soltec, "Pad lifting, fillet lifting and fillet tearing issues in LF soldering". The use of LF solder alloys today has brought about a recurrence of this crack formation, called fillet tearing. The

Wave Cassettes and Heat convection

Electronics Forum | Tue Jan 16 07:07:17 EST 2007 | tk380514

Answers: The component does take solder, no problem We get a full barrel fill with an empty PCB but only on one of the holes, the other hole has so much copper around it. The flux reached the top of the PCB when I tested the empty PCB. The IPC-A-610


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