Electronics Forum | Tue Aug 20 15:36:31 EDT 2013 | sevenzero
http://www.flickr.com/photos/61443293@N03/9555358689 Compiled some screen grabs. The only example I had offline is a top inspection of a TH leg. Same idea. Picture 1: Add Solder Insp. Picture 2: Hist Perams. Adjust bottom slider until what you know
Electronics Forum | Mon Aug 01 06:59:02 EDT 2005 | Joseph
Dear all, We observed visible micro crack at top side of solder fillet during lead free wave solder process. We did not see any visible micro crack at bottom side, and it always located at joints of transformer. Any input be much appreciated. Best
Electronics Forum | Sat Aug 28 14:16:18 EDT 1999 | JohnW
Doug, Have you tried running the boards at an angle to the wave of between 15 - 30 degree's ? I've done this on a few boards to eliminate short's and I believe it will work on your problem very sucessfully. Best thing to do is get your wave solder c
Electronics Forum | Tue Aug 31 08:10:38 EDT 1999 | Brian Conner
| I am building a board with T1/34 LED's in a 10X10 array there are 12 arrays in a panel. The LED's are body to body in the array, .1 spaced. The LEDS have been autoinserted on a Universal RAD III, so they are cut and clinched. The trouble I am havin
Electronics Forum | Wed Jun 27 21:56:31 EDT 2012 | davef
I'm spinning on this. Are we talking PTH or SMT?
Electronics Forum | Thu May 09 11:59:34 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Thu May 09 12:00:32 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Mon Dec 22 19:43:43 EST 2003 | Dean
I have seen this affect on Immersion Tin and OSP. 70 to 90 % of the solder wicks to the lead and forms a "single" homogenous solder mass. This even though the pad was 100 % covered with paste... Evaluated different solder paste...did find variatio
Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Electronics Forum | Thu Jun 28 09:43:25 EDT 2012 | ssupertuba
I'm sorry. These are SMT caps such as a C0805C271J1GAC. Small 0805 caps. I know they gennerally give you solder balls that sit on the side of those parts but they wash off.
.gif)
