Electronics Forum | Tue Feb 28 14:32:26 EST 2006 | masrimhd
As I know, the encapsulation effect occurs only with rosin based fluxes. So if you have a PBA soldered using RA Flux, you should either wash it well, or leave it alone and it will be safe. For NC process the story is different because there�s no re
Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef
It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in
Electronics Forum | Tue Nov 07 08:01:10 EST 2006 | davef
We/ve never heard of "glass wicking failure" in regards to board fab. Boat fab, yes. Look here: http://www.boatdesign.net/forums/showthread.php?t=13321 Barrel cracking appears after thermal stress during soldering, because epoxy expands in the "z"
Electronics Forum | Fri May 25 08:06:19 EDT 2007 | davef
Soldering PTFE boards * Exposure to the high temperatures needed for solder reflow poses no problem of loss of peel strength since the exposure times are relatively short. * There are many different types of PTFE based products that may perform diff
Electronics Forum | Thu May 31 10:52:31 EDT 2007 | patrickbruneel
A solder wire classified as L0 under IPC J-STD-004 means that the flux residues can be left on the board safely, and when you select this type of cored wire the intention is not to clean. You just select a solder wire that gives you an acceptable lev
Electronics Forum | Thu May 31 11:26:33 EDT 2007 | gsala
Tnks Patrick, additional infos..... we are just playng with different NC solder wires L-F, the best results in terms of solderability (faster solder flowing, holes filling up) it seams are coming from an ROM1, as we know, according to J-STD-004, or
Electronics Forum | Thu May 31 12:21:14 EDT 2007 | patrickbruneel
Let me give you some good advice You take already plenty of risk going lead-free, DO NOT use halogen containing fluxes in a lead-free no-clean process. Halogens left on the board will convert tin, silver and exposed copper into metal salts over tim
Electronics Forum | Tue Jul 31 15:33:30 EDT 2007 | gregs110
I have seen a few threads about delamination issues on IS410 laminate in RoHS applications. I have recently been running into a rash of issues on 4 different part numbers with a single PWB source. All the parts have been built fine in the past with
Electronics Forum | Tue Jan 15 21:44:05 EST 2008 | davef
We believe that tip tinners reduce the life of the tip, also. Why do you use such a product? We like using solder paste to clean solder tips. Place expired solder paste in a covered container. Open container and dip the tip. It comes out clean and s
Electronics Forum | Sun Jun 07 09:01:47 EDT 2009 | davef
IPC T-50, Revision H, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, 96.2176 Pad Cratering. A separation of the pad from the printed board resin/weave composite or within the composite immediately adjacent to the pad as