Electronics Forum | Mon May 11 18:30:10 EDT 2009 | boardhouse
Hi Milas, Here is a link to an artical on the subject. http://pcdandf.com/cms/content/view/4784/95/ The big difference in the to is that ENIG is self limiting where as electroplating is not. All product manufactured with either finish goes throug
Electronics Forum | Tue Jun 02 20:47:12 EDT 2009 | isd_jwendell
I was hoping some-one would help you with this because I too would like more information about selecting stencil thickness. I have read some about apperature ratios, but this alone doesn't appear to be the only factor when chosing stencil thickness,
Electronics Forum | Fri Jul 17 19:43:20 EDT 2009 | fujiphil
Have you eliminated the hardware N.G.? Check the connection for the rear door. If the connection are ok, try to bypass the key. short the two wires for the rear door. If the rear door problem is corrected, check the rear door switch physically. Reg
Electronics Forum | Thu Sep 10 15:06:11 EDT 2009 | dyoungquist
My guess is that he is talking about the gold plated pads not fully wetting with solder. We have seen this on some of our ENIG boards with the gold still showing at the far corners of the rectangular pads. Not knowing if this is hand soldering or p
Electronics Forum | Thu Oct 01 16:56:40 EDT 2009 | gplume
Does anyone out there have experience soldering with Pb solder (Sn 63 or Sn 62) to SAC 305 coated PCB lands (about 50um) or Sn-Cu plated lands (about 10um). I know soldering Pb free (Sac based soler) to Pb/Sn coated lands is a no-no, but was waonderi
Electronics Forum | Thu Oct 08 11:33:16 EDT 2009 | cab
We are currently wirebonding MCMs with surface components located in very close proximity to wirebond pads, which are gold plated. We are ball bonding with 99.99% Au wire. Normally we do not have problems, however if product has been reflowed seve
Electronics Forum | Mon Oct 19 15:43:37 EDT 2009 | dilogic
We have a problem with QFN IC's with NiPdAu plated pads. Our ULC's don't see the pads due to the almost ideal reflection. Vision sees the pads almost black. As we don't have OAL-cameras (which can help in this case, I assume), I am thinking of back-l
Electronics Forum | Thu Nov 12 04:35:13 EST 2009 | sachu_70
You can certainly venture out to the nearest lab for in-depth analyses. But since you mention 2-3% defectives in a batch, there is much you can do in-house as well. Measure the height of your solder paste deposit (in zero print gap condition)across a
Electronics Forum | Thu Dec 17 18:08:41 EST 2009 | lynn_norman
Back in a former life, we had 3 products that were PCBs bonded to aluminum boards. We used a PSA from 3M to bond the board to the aluminum. Polymers are almost invisible in x-ray, but ultrasound worked quite well. You should try CSAM. Don't know
Electronics Forum | Sat Feb 27 01:16:16 EST 2010 | jmelson
I had a batch of Xilinx chips that I believe had microscopic hairs of the lead frame left as slivers on the leads. These maybe got encapsulated by the solder plating, and then were free to move when the chips were reflowed. You could see the tiny h
