Electronics Forum | Thu Feb 14 10:59:37 EST 2008 | stevezeva
Maybe what you could do is have the stencil contain a tightly spaced mesh or grid of openings over the ground plane areas that you need to be solder covered. Also, to help the solder flow out better, you might want to decrease the percentage of metal
Electronics Forum | Mon Jun 01 18:44:54 EDT 2009 | scunneen
Hello there, I have a new board, fairly heavily populated with a number of FPBGA on it. The smallest has a pitch of .4mm.I have 3 questions, 1st what is the best appeture for this small pitch. 2 Will type 3 paste work or will I need type 4, and fina
Electronics Forum | Tue Jun 02 22:19:17 EDT 2009 | mikehe
We have been doing BGA's for years now, and I would suggest updating your profile and place a thermal couple on the BGA, keep in mind the bigger the part the more heat it will need, We stencil print all of BGA's from simple bga's to complex ones, you
Electronics Forum | Fri Aug 28 05:07:59 EDT 2009 | sachu_70
Do you clean the stencil manually or using the automated under-stencil cleaner on your Printer (recommended)? 1. Ensure that stencil wipes are lint-free and soaked sufficiently with solvent before use. 2. If your printer supports automated cleaning
Electronics Forum | Mon Aug 16 14:43:44 EDT 2010 | dan_ems
Hello, i don't know if is possible to dispense paste but for reduction of cost we use a diferent type of stencils, from aluminium of 0,2 mm, purchased from a typography of newspapers. Ofcourse the pcb for what we use this stencil are simple. But th
Electronics Forum | Tue Mar 22 14:07:43 EDT 2011 | remullis
I've never done flex boards so I cant't say what tolerances you would need to maintain. Does you stencil manufacturer provide a QA data sheet with your stencils? If so I would specify to them the critical apt sizes in areas and push it back on them t
Electronics Forum | Fri Jul 08 12:45:10 EDT 2011 | markhoch
It's a $40 adder to my stencils if I have them apply it. But I've just discovered that if you have THEM add it, they add it thru a stencil and only apply it to the appertures. (My guess is they do this because it allows them to use much less material
Electronics Forum | Thu Jul 21 19:53:20 EDT 2011 | isd_jwendell
Using AIM N.C. paste, just ran 10 panels to test after applying Rain-X to the stencil (pre-clean with IPA). Printing and release were slightly better (maybe my imagination), but not a large difference. Stencil remained cleaner longer. I could not tel
Electronics Forum | Fri Dec 09 11:00:27 EST 2011 | alexanderb
Dear All, I am a totally new to the SMT process. In fact, I just had an overview course regarding the whole process of PCBA manufacturing and I have know a bunch of questions in my head. Most of them are linked to the solder paste printing process
Electronics Forum | Fri Feb 03 09:50:37 EST 2012 | mosborne1
Thanks very much everyone. > > I'll try out a > 5mil and see how that goes. If you are using 6mil stencil and you are saying that you need more on the 0603 parts then you might want to look at your squeege pressure. What kind of squeege blades ar
