Electronics Forum: resin (Page 18 of 30)

Soder Paste Shelf life extension

Electronics Forum | Wed Feb 23 03:12:25 EST 2011 | pkannan

You are very right. There are 2 major factors 1) There is going to be Flux separation. This is basically due to fact that metal particles are heavier than the Flux vehicle system, and due to gravity effect they slowly drift downwards leaving the ligh

Solder Paste Shelf life extension

Electronics Forum | Wed Feb 23 03:22:47 EST 2011 | pkannan

(Corrected the Subject line - sorry for Spelling ) You are very right. There are 2 major factors 1) There is going to be Flux separation. This is basically due to fact that metal particles are heavier than the Flux vehicle system, and due to gravity

Tankless ... What I Took Away

Electronics Forum | Fri Feb 22 18:19:16 EST 2013 | davef

First, it's not a simple as thinking just about your electric meter. * Water heaters need to be DI proof, stainless or ceramic. * The longer that DI water is exposed to air, then closer it becomes like tap water. So, you need to be monitoring DI leve

Wave solder flow over back plate

Electronics Forum | Thu Feb 21 10:11:36 EST 2013 | patrickbruneel

The backflow in the wave started to become very important with the development of no-clean/no residue fluxes. These fluxes don’t have (or at least shouldn’t have) rosin, resin or other vehicles in the formulation which encapsulate surface oxides from

where to get good flux

Electronics Forum | Wed Apr 03 04:08:20 EDT 2013 | ericrr

Yes well, now we used to add a bit of flux to our leaded paste to make it slightly runny, But when we went to unleaded paste the joker who came in from another company to set the temperature on the oven said "you dont add anything to unleaded paste!.

Ionic Contamination Testing

Electronics Forum | Tue Nov 07 00:33:40 EST 2017 | aqueous

If no-clean flux is reflowed correctly, many of the activators are encapsulated within the resin residue left behind after reflow. An ionic contamination test cannot differentiate between ionic residue that was encapsulated (not harmful) and residues

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Thu Apr 04 09:45:58 EDT 2019 | davef

That's what I guessed. Some ideas to consider are: Reduce usage of flux to the bare minimum. Choose a low solids flux Flux residues can be categorized as soft, brittle, sticky but this depends mostly on the formulation of the flux and the resins

Foam in inline wash

Electronics Forum | Tue Nov 14 14:08:44 EST 2023 | hhudson

Good Morning, I'm a relatively new engineer, and i've been experiencing a lot of anomalies when it comes to our inline wash. We have an Austin American Hydrojet, and no matter how many times i clean the tank, it still foams like crazy! its been happe

Re: DI water

Electronics Forum | Fri Apr 02 11:18:02 EST 1999 | Scott McKee

| | We've been using a newly installed DI re-circulating system. | | It's been a big headache. Mostly understanding what causes our resistivity to be unpredictable. I think I've got a handle on that part now. The system consists of a Carbon,HMR(cheal

Re: PCB Standards

Electronics Forum | Wed Jun 10 18:40:00 EDT 1998 | Earl Moon

| I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over


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