Electronics Forum: thermal pad (Page 18 of 49)

Yield on 0402 SMT Printed Circuit Board Assemblies

Electronics Forum | Wed Jan 10 20:06:43 EST 2007 | SSS

I've been assembling thousands of boards for dozens of customers over the past 5 years with 0402 chip components. 85% can happen very easily even with newer equipment. Defect challanges with 0402 packages is almost always tombstoning. Capacitors abou

EP&P Magazine, MDS Artical

Electronics Forum | Fri May 15 16:02:40 EDT 1998 | John S

If you have a chance check out the MSD artical (Page 69) in April Electronic Packaging & Production. It is one of the worst articals with unsubstantiated conclusions I have ever seen. Notice Figure 3 on page 72, Caption indicates two simular compon

solder ball

Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ

Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A

Re: Cracking Capacitors

Electronics Forum | Wed Sep 09 01:28:33 EDT 1998 | John Godfrey

I am in need of possible causes and solutions to capacitors that are failing in the field. Are there issues in our process that need to be checked? Some people said the problems are due to improper storage. Others say it is th

Bright surface mount led's?

Electronics Forum | Mon Jun 06 09:05:02 EDT 2005 | cmiller

How do apply it in your process? It would seem best to screen the electrically conductive epoxy then dispense the thermally conductive epoxy to bond the part to the heat sink pad. Any help or opinions would be appreciated. I dont think the System Uni

Bright surface mount led's?

Electronics Forum | Mon Jun 06 10:02:39 EDT 2005 | cmiller

How do apply it in your process? It would seem best to screen the electrically conductive epoxy then dispense the thermally conductive epoxy to bond the part to the heat sink pad. Any help or opinions would be appreciated. I dont think the System Uni

DQFN INSUFFICIENT SOLDER / HEAD ON PILLOW

Electronics Forum | Fri Mar 06 12:02:36 EST 2015 | saoasasd

So far we have tried diferent date codes, solder pastes and PCBA models (same component used in different projects). We have also sent some components for plating analysis and we are waiting the LAB feedback. Additionally, we have tried components wi

Re: T sub G

Electronics Forum | Tue Aug 25 17:49:15 EDT 1998 | Earl Moon

Hello, Our PWB supplier has requested that a change in the laminate material to reduce the incidence of pad lifting. The standard laminate materials (Polyclad PCL-FR-226 with a glass transition temperature of 135 C) have greater z-axis thermal e

Can you wave solder this part

Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef

National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun

Re: Cracking Capacitors

Electronics Forum | Wed Sep 09 10:02:46 EDT 1998 | Earl Moon

I am in need of possible causes and solutions to capacitors that are failing in the field. Are there issues in our process that need to be checked? Some people said the problems are due to improper storage. Others sa


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