Electronics Forum: rework (Page 180 of 293)

problem in solderability

Electronics Forum | Mon Sep 01 09:49:54 EDT 2008 | allan99

I told a friend this problem, and he also thinks the problem is the component, and suggested a different solder paste (more acid), maybe you can ask your supplier for a sample and orientation. Until there I think you have to rework if its only one co

BGA replacement process

Electronics Forum | Tue Sep 09 16:00:07 EDT 2008 | ppcbs

We always bake our loaded boards before any BGA rework is done. 12 to 16 hours at 100 c. We have had incidents in the past on loaded boards where 125 c has melted parts and the occasional low temp BGA trays. 100 c has proven safe for the past 10 y

SMT Connector, Placement Issues

Electronics Forum | Tue Oct 07 03:53:21 EDT 2008 | finetech_bln

Hi - maybe FINETECH (http://www.finetech.de ) can help you. They did evaluate the reworkability of SAMTEC connectors. The FINEPLACER Pico offers 5 �m placement accuracy (http://www.finetech.de/enid/picors ) - the precise placement should not be much

Jot Automation inspection conveyor failure

Electronics Forum | Tue Oct 21 08:06:15 EDT 2008 | maheshbs

I have problem in Jot Automation inspection conveyor. The Problem is that the Good board has to go in down side conveyor & Bad board has to go in upside for rejection or rework. It is unable to separate the good & bad boards. Kindly refer the attachm

Building RF Power Transistors Test fixtures

Electronics Forum | Mon Nov 17 21:04:09 EST 2008 | davef

Continuing with the idea of capping the via with SR1000: If you have boards in-stock that will require all the putzing around that you've doing to prevent the solder flowing through the via, consider reworking your stock with SR1000 to prevent all th

BGA soldering & BGA ball formation

Electronics Forum | Sun Nov 23 10:03:19 EST 2008 | tsvetan

Hi, yes, you can, but it will be subject to long learn curve where i live there are hundreds of GSM repair shops which do BGA rework and replacement with $50 hot air guns only, but i guess they had lot of BGAs damaged before they have learned how to


Electronics Forum | Fri Jan 09 18:43:07 EST 2009 | focalspot

Give a call into FocalSpot at 858-536-5050...Our website http://www.focalspot.com also has info...we have all the information including the recent changes in Mexico , but suffice it to say we can provide guidance andf contacts for all states. After a

TSOP lead deformation (help)

Electronics Forum | Mon Jan 26 15:13:23 EST 2009 | john123

Emil, The issue that caused the problem has been solved and corrected. The problem I'm having now is I need to prove their acceptability to others or I'm faced with scraping/reworking thousands of parts. I agree that the parts should be accepta

QFN's and LGA's

Electronics Forum | Fri May 22 08:04:30 EDT 2009 | stevezeva

Have any of you ever worked with Actel's QFN 180? A three row I/O QFN? Actel has a published paper on design and assembly guidelines, but we're finding that they are pretty much generic, and don't really work as well as they lead you to believe. ht

underfilling of bga

Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo

Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar

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