Electronics Forum | Tue Aug 27 22:07:45 EDT 2002 | davef
Pad. Land. A portion of a conductive pattern used as a termination area. Metal surrounding a hole on a printed circuit board. Mask. A material applied to allow selective etching, plating, or protection of the surface of a printed circuit board.
Electronics Forum | Thu Jun 25 10:05:05 EDT 1998 | Chris Sargent
I have got a strange problem with a customers board. The problem being that I have had a number of boards returned to myself for Dry Joints. When you examine the joints, the solder fillet is perfect, the only problem being that it is attached to th
Electronics Forum | Fri Jan 23 12:34:28 EST 2015 | dyoungquist
Our nitrogen generator and an air drying unit came with the selective solder machine when it was purchased new in 2008 as a package deal. We originally were feeding the system with air that was not properly dried. That lead to some maintenance cost
Electronics Forum | Fri Mar 24 13:02:53 EST 2000 | Ashok Dhawan
Two questions on ESD: 1. What is recommended method ( Air ionizer , grounding strip etc. ) for a board prep ? We Kapton Tape for masking pads or not to be soldered areas. or Is there a wet mask recommended for masking boards campatible with NC Sold
Electronics Forum | Mon Nov 06 13:35:10 EST 2006 | Theresa Spear
We are starting up a new clean room for SMT production and wondering if anyone is aware of any guideline for operating humidity and temperature ranges for the room. We know that the MSD's will prefer it to be dry and cool. However, there are other f
Electronics Forum | Sat Apr 04 17:11:29 EST 1998 | Steve Gregory
| Can anyone help with advice on the possibility | of "rejuvinating" aged solder paste | for SMT applications. | Thanks! Peter, I wouldn't even try...even if you had all the different chemicals that you needed to do it properly, the formula's f
Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera
Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo
Electronics Forum | Thu Aug 13 12:55:46 EDT 1998 | Dave F
| Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | Xingsheng Xingsheng: Welcome. Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill Web resources: http://www.pwbrc.org/ a
Electronics Forum | Thu Oct 10 21:41:38 EDT 2002 | surachai
No need to change solder pot ,anyway the contamination during clean and no clean flux may happen when change from clean to no clean which it will float on the surface of solder pot , you only clean it ( same as the dross removal ) due to in the norm
Electronics Forum | Wed Aug 26 03:21:00 EDT 2009 | sergey2007
Hi Graham, the MSD level of the component is 3. I am not sure that my customer properly stored the component before the soldering process. And I am not sure that it was dried at all. The customer says they did everything that they had to, but I just
