Electronics Forum | Tue Nov 30 17:47:25 EST 2010 | ck_the_flip
1.) Are there any industry white papers written that document any advantages in running this alloy? From what I've read, this alloy was formulated to prevent leaching of silver for silver-bearing component terminations. 2.) Are there any concerns w
Electronics Forum | Tue Feb 08 17:23:55 EST 2011 | bandjwet
Has someone had really good experience with the softening of silicone conformal coating using a specific chemical? One of our clients just came in with a board with Dow 1502 silicone coating on it. We generally mechanically remove the coating for re
Electronics Forum | Thu Mar 31 08:04:13 EDT 2011 | tommyttr
We are looking to start/buy or lease a small SMT factory. Our goal is to do mostly prototypes and also some overflow production. We are looking for a 1 line factory, solder rework stations, oven, etc. Looking for a location within the USA. Please con
Electronics Forum | Mon Aug 22 11:54:59 EDT 2011 | blnorman
A good epoxy should work. Removal would require damaging the board, component, what ever it is attached to. I know Hardman makes a bi-pack ambient cure epoxy that we used in the lab. Search the web for epoxy suppliers, they'll offer various cure s
Electronics Forum | Sat Aug 27 12:10:55 EDT 2011 | kahrpr
Basically it pretty standard to run through the board. For programmers /manufacturing engineers it’s a catch 22. If you check everything management is complaining it takes too long. If you don’t check management is complaining because of rework and y
Electronics Forum | Mon Feb 27 09:43:42 EST 2012 | andrzej
We use succesfully SN100C on ERSA330 for about 2-3years. Pros: - price, - less dross comparing to SAC305, - some ppl say better mechanical durability comparing to SAC305 (depends who pay for "independent" studies) Cons: - higher melting temp so r
Electronics Forum | Fri Jul 06 10:45:02 EDT 2012 | ashworth14
In relation to question 2 the vacume on them is quite sensitive so as long as you bring it down slowly the component is almost sucked up off the PCB so you don't have to actually press it down on the the component, and i have never experienced any so
Electronics Forum | Wed Jul 04 12:18:14 EDT 2012 | davef
Phil is correct in his description of proper rework technique. Possible explanations of the reason for popping of your BGA are: * Thermal cycling of components cause them to flex on a different point in the cycle that the board possibly resulting in
Electronics Forum | Tue Sep 18 12:47:33 EDT 2012 | mbnetto
Hi, Regarding to thermocouple placement, you should use a precision thin drill. Drill through the bottom of the board to the top as follows: One hole in the center of the part, preferably into one of the center balls, if available. One hole into the
Electronics Forum | Fri Feb 01 10:54:35 EST 2013 | dyoungquist
Regardless of the surface finish, you should try to limit the reflow cycles to 3 with no more than 5 at most. This includes reworking a BGA site as well. Remember that heating/cooling to remove a BGA is one cycle and heating/cooling to place a BGA b
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