Electronics Forum | Fri Jun 28 06:12:27 EDT 2013 | grahamcooper22
If the soldering process isn't heating the whole package up to soldering temp then NO you don't need to keep them DRY (using a soldering iron to fit a QFP for example)....but if the soldering process is done on a rework station or in a manner where t
Electronics Forum | Mon Jul 08 14:52:40 EDT 2013 | hegemon
The smaller ball "missing" from the lower left is from solder migrating down into the adjacent via. The solder mask may have been damaged or missing prior to mounting the BGA device. The larger balls at the top right are due to uneven heating during
Electronics Forum | Fri Dec 20 15:38:53 EST 2013 | island2013
Aperature layout on your stencil could be a root cause as well. Home plate design aperatures have cleared this issue up for me in the past. If it's a clean product, running through the wash may get rid of quite a few of them. Also check your IPC s
Electronics Forum | Tue Feb 18 11:47:50 EST 2014 | rgduval
Is there a reason you're considering bead-blasting the conformal coating? It seems like a bit of overkill. Most of the cc that I've used over the years either has a solvent that will dissolve it, or will dissolve with heat. Heat has been our go-to
Electronics Forum | Thu Feb 27 13:59:52 EST 2014 | rway
I agree with Comatose; although, 30 seconds I feel is stretching it bit. I would say anywhere from 40-60 sec. 5 seconds for removal 15 seconds to install (tack) 10 seconds to solder 10 seconds for inspection There's no need to dress the pads. Use t
Electronics Forum | Thu May 08 18:21:13 EDT 2014 | jorge_quijano
Hola, We are about to start building a new PCBA using a LGA, we have not used such components in the past, is there any recomendations you can provide me? I've found some articles saying that stencil thickness is the key, what is your experince usin
Electronics Forum | Thu Jun 26 14:23:37 EDT 2014 | davx
Thanks for the hint. Managed to identify it easier with the codebook, it turned out to be a Phillips A6p Fast acting switching diode. Luckily I found a A6t (same but made in tiawan), tested to see if the forward current drop was the same and rework
Electronics Forum | Wed Dec 03 14:43:09 EST 2014 | sarason
I used to use a Festo branded Hand placement machine to rework boards. All I can say is don't waste the cash. A vacuum tweezer system and a well laid out tray stuck to the bench was at least twce as fast as the Festo. The reason is plainly obvious yo
Electronics Forum | Mon Dec 15 18:22:36 EST 2014 | mcapizzi
As was stated, there are a number of variables that could come into play. I have used AirVac DRS26 and SRT Machines. We are now using Shuttle Star which has IR as well as hot air heat. This works much better for us. You can view these at. http://www.
Electronics Forum | Fri Dec 12 02:11:35 EST 2014 | acepa
We have 6,000 TI BGA's to remove from a PCBA and reball for reuse. TI DaVinci BGA, DIG, Media, 284 ball part number TMS320DM8148SCYEO Does anyone have a formal repair procedure or knowledge of such rework for such a part they would be willing to sh
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