Electronics Forum | Mon Feb 27 09:09:36 EST 2006 | davef
Silver on your copper or brass part is a solderability protection. The silver diffuses into the solder and you solder to the base metal, either the copper or brass in your case. Soldering to copper is well known. The issues are soldering to brass
Electronics Forum | Fri Mar 03 16:05:42 EST 2006 | Chris
Hi, Anyone ever perform a DOE on prepreg glass bundle direction or glass bundle grain and how or if it affects PCB warpage and chip component cracking at V-score depanel? Since most FR4 and prepreg has has 1.4 times more fiber bundles in one direct
Electronics Forum | Mon Mar 27 15:10:48 EST 2006 | ms
Hi Steve Thanks for your reply. Your comments make it sound like it may be the nature of this paste. Any one else agree? Paste control is fairly good. Paste is put in fridge straight after it arrives at inwards goods, (4deg). Removed from fridge
Electronics Forum | Wed Apr 19 20:33:14 EDT 2006 | davef
I just flew in from (insert city) and boy are my arms tired. pr: Likely, you're correct. The "pound-inch" units should have been the give-away, for us. Good catch. If this is the case, the frame fabricator would be the best source for tensioning
Electronics Forum | Wed Jul 26 14:40:28 EDT 2006 | FredC
I just checked a hand full of scrap nozzles and the scuffing is usually on the right or left of the needle. If you have the cross pin facing you and looking down on the nozzle most of the scuffing or wear was on the left side, sometimes on both sides
Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef
It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in
Electronics Forum | Thu Sep 14 06:45:11 EDT 2006 | Rob
Hi Mika, We had roughly the same set up - AP27 -CP6x2, GSMx2, VIP98 & we ran the thin boards with durastone routed pallets. If you route out a 0.4mm pocket on the pallet and either use kapton tape/high temp masking tape/ or 3M spraymount to hold
Electronics Forum | Tue Oct 17 03:13:10 EDT 2006 | charless
Apoligies Steve if I did not explain myself clearly. We have made the same design using the same RoHs compliant components (which I am assured by the suppliers are process temperature capable) with both lead and lead free solder. Without wishing to
Electronics Forum | Tue Nov 07 18:56:40 EST 2006 | Steve
Thanks guys! Very helpfull info. SWAG, the manufacturer states that this material can withstand up to 350 Celsius for a short time period (around 10-20 seconds). It is my understanding that Durostone absorbs heat very very slowly like ceramic thus
Electronics Forum | Thu Nov 02 15:46:43 EST 2006 | rgduval
I'm looking for some information on soldering irons being used in my no-lead process. Specifically, my floor seem to be burning out tips at an alarming rate, when soldering lead-free assemblies. Today, I had one woman burn out a brand new tip in 4