Electronics Forum | Mon Nov 06 02:56:11 EST 2006 | Loco
*We've tried the WSP80s for leadfree, also SAC. Problem with these was when they are not being used, they keep their temp and oxidate like hell. Second problem is as Russ states, the sensor is not in the tip, therefore to get the same heat in the t
Electronics Forum | Wed Nov 15 09:36:27 EST 2006 | Board House
Hi AJ, The biggest mistake in the industry today is documentation for lead free assembly required product. We are still seeing prints coming in saying Lead Free / High TG FR4. When in reality standard FR4 170 Tg. material is considered High Tg. and L
Electronics Forum | Mon Dec 18 16:13:15 EST 2006 | darby
AJ, No overprint. We have components in very close proximity that precluded that. Also we have differing areas of thermal relief for the pads from a large backplane, from none at all to open blocks to individual pad relief. After a few more experimen
Electronics Forum | Thu Dec 14 22:28:38 EST 2006 | Tony
Hi, where can I find info about how to make the pad design to work for VSSOP48 0.4 mm Pitch & TSSOP56 0.5 mm pitch components? I should also mention that we are working in a project that this 14 layers High-Frequency RoHS board is included. The pad c
Electronics Forum | Tue Dec 19 12:14:47 EST 2006 | realchunks
Hi Darby, No, I'm not cutting on the robot guys. I actually went thru their site and found it interesting. They truely use their knowledge and creativity, which is a rare thing to find these days. That, coupled with their common sense and resourc
Electronics Forum | Mon Jan 29 15:21:56 EST 2007 | flipit
If you teach your feeders, you can no longer gang pick correct? I have never had a dual beam or dual head GSM before. However, if you teach feeders with the fiducial camera and your picks are still off, there is an offset in one or several spindles
Electronics Forum | Thu Mar 01 22:21:06 EST 2007 | davef
From our notes ... An intense evaluation was completed in 1992 that involved testing of three board types [6 layer FR4, 6 layer ceramic copper thick film, and a 4 layer copper-invar-copper board] by the Navy Surface Warfare Center, Crane, IN. [Obvio
Electronics Forum | Mon Mar 19 05:51:24 EDT 2007 | pima
Hello I made some test on different oven and problem still occurs. The only progress is that with diffrent thermoprofil ( Ramp to Spike instead of Ramp- Soak- Spike skewed components appears at 1 % of produced parts). With Ramp - Soak-Spike we have p
Electronics Forum | Mon Apr 09 14:53:19 EDT 2007 | flipit
Hi, We were running with few defects with lead solder paste. The lead solder paste with stencil 0.010" X 0.020" and 0.004" thick stencil produced near defect free PCB assys. 0.010" X 0.020" (0.004" thick) lead = defect free 0.010" X 0.020" (0.005"
Electronics Forum | Sat Apr 14 09:28:58 EDT 2007 | davef
When soldering a component to a board, the solderability protection on the component combines with the solderability protection on the board and the solder to form an alloy. This alloy is unique for that combination of solder and solderability protec
