Electronics Forum | Wed Mar 22 17:28:13 EST 2000 | Steve Harshbarger
Donnie, It's funny you ask this question. I just last month was at a company doing exactly what you are asking (Alpha 310 flux with infrared heating). They were successful, but they had 2 important things going for them. 1) A spray fluxer that wa
Electronics Forum | Sat Aug 11 09:33:09 EDT 2007 | davef
Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no baking of assemblies, only boards [and for the anal, components]. J-STD-001DS, 4.9.3 Drying/Degassing. Prior to soldering, the assembly shall be treated to
Electronics Forum | Tue Sep 05 16:04:43 EDT 2000 | Dave F
Pascal: Responding to your questions: 1 Do we have to dry the PCB after cleaning (sic)? Generally, nothing says you have dry the PCB after aqueous cleaning. Along this line, I received several thoughtful responses when I posted a similar thread.
Electronics Forum | Thu Jul 25 05:56:32 EDT 2002 | ericchua
Hello, Understand you have problem of cleaning adhesives from Dek Pump Print stencil. Well, we have a cleaning machine which able to clean solder paste and adhesives. And also, we are not using any chemical but use water-base detergent. We had few c
Electronics Forum | Tue Feb 06 18:19:30 EST 2001 | davef
Now that's surprising that your board fabricator would say the mask was cured properly [without even inspecting the boards]. I wonder if they can backup those BOLD words when testing your boards with the webbing problem. The reason you can�t find t
Electronics Forum | Thu Aug 30 16:17:07 EDT 2018 | emeto
First suspect PCB contamination - clean the boards, bake/dry them, try again.
Electronics Forum | Fri Jan 24 17:00:56 EST 2003 | razan3
RMA needs to be dry prior to the wave to work. If coverage is good and part orientation is good, then you should be okay. Pad size can be adding to the amount of material left as well. Granted it soldered before fine with .2 long leads, I would di
Electronics Forum | Thu Jun 24 15:44:12 EDT 1999 | Earl Moon
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
Electronics Forum | Thu Sep 11 23:50:51 EDT 2003 | Dean
Epoxy is hydroscopic. A cavity will form when the cure furnace reaches the boiling point of water. The steam expansion creates the pocket. It can be large enough to be filled with molten solder from the wave machine and cause a hard short under th
Electronics Forum | Fri May 09 09:09:22 EDT 2003 | fmonette
Phil, here is why "dry cabinet storage may not stop the clock" : The moisture diffusion inside a component is actually quite complex. When previously exposed components are returned to dry storage, the moisture gradient that is already absorbed in
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