Electronics Forum | Wed Mar 14 12:06:15 EDT 2007 | Oswaldo Rey
There is an approximate 1W dissipation and has a 2 sq in area below part on solder side as a heat sink, vias are to physically conect this solder side area to power pad, so its necessary to use an adequate amount of paste. I really don�t think it has
Electronics Forum | Tue Jun 26 14:28:50 EDT 2007 | bjrap3
I have been trying to rework a lead-free BGA. For some reason, when I remove the BGA the corner pads on the board come off and the board must be scrapped. If I do manage to remove the BGA successfully, when I solder the BGA, the corners of the BGA
Electronics Forum | Fri Jun 29 09:51:27 EDT 2007 | bjrap3
I have never had a problem with any other BGA's that I reworked. I recently found out that the BGA that we are trying to rework is made poorly and warps automatically from the heat. There is nothing that we could do to prevent this. Also the board
Electronics Forum | Fri Jul 13 10:57:04 EDT 2007 | dboudreau
Dear all, we are using the lead-free SN100C solder alloy for wave soldering. We are experiencing wetting problems each time we have to solder a thick board or a board with a large ground plane.I think that maybe we are not using the right flux. I w
Electronics Forum | Mon Jul 16 16:02:08 EDT 2007 | ck_the_flip
I have zero experience with SN100c, but hey, how much different can it be from Sn63Pb37?! We solder large connectors all the time - sometimes these connectors reside on a ground plane area. We've been able to overcome hole fill issues (on 63/37) th
Electronics Forum | Mon Oct 08 18:21:27 EDT 2007 | mariss
We have recently acquired a Passaat SMRO-0406 oven. The manual is uninformative for oven settings. Can someone supply us with starting points for conveyor speed, Zone 1 to 4 and 5 to 8 temperature settings please? Our boards for a product we manufac
Electronics Forum | Thu Feb 14 10:59:37 EST 2008 | stevezeva
Maybe what you could do is have the stencil contain a tightly spaced mesh or grid of openings over the ground plane areas that you need to be solder covered. Also, to help the solder flow out better, you might want to decrease the percentage of metal
Electronics Forum | Tue Jul 01 17:15:03 EDT 2008 | ronhodgson
I would like an interpretation of a solder fillet on a 5 side termination cap. (Ref: IPC-610, sec. 8.2.2.6). My question pertains to the definition of dimension F, and what constitutes the top of the fillet. Does the top of the fillet end at where
Electronics Forum | Mon Sep 15 11:03:51 EDT 2008 | swag
Thanks all for the input. There are no tants. close to these parts. GSx - you are correct in that this is ROHS compliant component so maybe a plating issue. We have done what you describe but to a lesser peak with fair improvement. Not seeing muc
Electronics Forum | Thu Nov 27 10:55:51 EST 2008 | muarty
Hi Steve, Are you actually profiling the BGA itself? By that I mean have you, for example, drilled through the underside of the pcb into the balls of the BGA and attached a probe there? You may find that even although the topside components have a p
