Electronics Forum: stencil (Page 195 of 541)

Fine pitch paste release problems.

Electronics Forum | Mon Dec 16 21:34:05 EST 2002 | grantp

Hi, Yes, the stencil does touch the PCB. Is there another method? Sorry to sound a bit dumb on that, however I don't have a lot of experience with automated stencil printing, and manual has been working well up to now with this BGA. Regards, Gra

Fine pitch paste release problems.

Electronics Forum | Wed Dec 18 01:37:39 EST 2002 | Steve

I dont know what kind of screener you use but my 1st impression is that the board and stencil are separating too fast,the paste doesn't have enough surface tension to stay on the board, you're tearing the paste off the board. If you can, slow down th

Stencil Printing Experiment without AOI

Electronics Forum | Wed Jan 08 14:36:44 EST 2003 | davef

It depends on your product requirements. We don't like to print off-pad, because: * Tough to control the amount of paste that squirts onto the board, because the aperture is not gasketed to the pad on the board. * Some paste that squirts between the

Stencil cleaner

Electronics Forum | Wed Feb 26 16:06:34 EST 2003 | slthomas

Something else I just thought of, and MikeK touched on it briefly, is what you'll be cleaning. If you need to be capable of removing both epoxy and solder paste, for instance, you need to look at chemistry and processes that will clean both, and the

TSOP40 Lead pitch 0.50mm recommended aperture sizes?

Electronics Forum | Thu Mar 06 10:57:28 EST 2003 | Mark

What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. And direction of squeegee print over the aperture? Recommended Stencil thickness? Recommended aperture reductions? Recommended pcb pad sizes? Recommended

MPM3000 vs 3050

Electronics Forum | Sat Dec 06 23:54:49 EST 2003 | Dean

3000 base model 3010 adds feature 3020 adds features 3030 adds features 3040 adds features 3050...top of the line Sorry I don't have the feature list. It's things like Environmental control unit, under stencil wiper, stencil exchanger, 2d inspe

BGA/Fine pitch footprints

Electronics Forum | Tue Mar 02 10:24:06 EST 2004 | russ

I have done this before, We print with a 5-6mil stencil and have had no problems with any underneath solder. If you are still nervous instead of removing from stencil use some 3 mil kapton tape or equivelant and tape off the BGA pads. This way the

Stencil Tension

Electronics Forum | Mon Oct 25 20:15:20 EDT 2004 | pilengr_tw

Davef, Thank you for your reply.You are right that I need to consider the tickness also of the stencil. Previously, I take for granted this process of measuring the tension and I usually let my technician do that. However, I have to determine the pra

Stencil Cleaner Chemistries

Electronics Forum | Fri Nov 19 16:38:15 EST 2004 | grayman

Hi, We only use alcohol for cleaning stencil but it gives us best result even with no clean solder paste. We are using Branson.Furthermore, we have fine pitch components.Try cleaning the tank maybe there are solder accomolation in the tank or try in

BGA question

Electronics Forum | Wed Feb 09 14:23:41 EST 2005 | russ

First off how thick is your stencil going to be? I have printed .5mm pitch with .009" apertures with a 6 mil stencil. A 5 mil would have been better but the 6 worked just fine. Pitch is not necessarily the deciding factor for paste type. it is the

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