Electronics Forum: stencil (Page 197 of 540)

Water Jet Stencil Cut

Electronics Forum | Mon Oct 03 14:14:06 EDT 2005 | Carmichael

My findings were that it wasn't accurate enough to create the crisp aperatures needed for release. That was almost ten years ago when everyone was looking for an alternative to chem-etch however. Water guided laser also showed promise of doing this b

smt machines function

Electronics Forum | Thu Oct 20 11:52:07 EDT 2005 | Amol

there are various SMT machines 1. Stencil Printer 2. Pick and Place machine 3. Reflow ovens 4. Automatic optical Inspection machines start with visitng Stencil printer websites like MPM, DEK etc. Pick and Place -- Univesal instruments, Mydata, Fuji

MPM AP25, separation problems

Electronics Forum | Wed Nov 02 08:21:45 EST 2005 | chunks

Yes, I agree, manual cleaning is not a solution, but does tell you you need to clean the stencil. You should have your stencil cleaner repaired and take that question mark away. Once all the question marks are goen you should be left with an answer

Need Help for CCGA Rework

Electronics Forum | Fri Nov 11 09:06:08 EST 2005 | russ

We use at least an 8mil thick stencil for these parts. The Columns do not collapse or reflow so you need to ensure plenty of solder volume for reliable attach and to make up for the coplanarity of the component itself. I assume we are not really ta

Fine Pitch Stencil Design

Electronics Forum | Thu Dec 08 12:24:11 EST 2005 | cyber_wolf

Any good stencil house should be able to recommend the proper configuration on a fine pitch aperture design. They can also advise you as to which foil thickness works best. The norm foil thickness is .005" - .006". There are always special instances

Fine Pitch Stencil Design

Electronics Forum | Mon Dec 12 16:08:37 EST 2005 | pjc

Here are some guidlines: http://www.tkb-4u.com/articles/printing/stencildesignguide/stencildesignguide.php www.indium.com/documents/applicationnotes/97742.pdf http://www.electronics.ca/standards/general/IPC-7525.html http://www.alphametals.com/pr

Solder Paste Problem (M705)

Electronics Forum | Fri Dec 16 06:46:12 EST 2005 | Rob

How about keeping a fridge near the line and only putting on the stencil what is needed, then topping up from the jar as & when? As soon as the paste hits the stencil flux will evapourate, and all of that time spent by people in labs developing comp

poor print definition

Electronics Forum | Mon Feb 20 17:12:54 EST 2006 | mark

Hallo all, I have recently had possibility to work with DEK265. I have met with problem poor print definition (no sharp edges). I used stencil 150 thickness, metal squuegees. I moved than the same stencil, squeegee and parameters to DEK nifinty and

SMT line validation

Electronics Forum | Wed Feb 22 08:01:42 EST 2006 | INGE

We have a new SMT line, our customers are asking us the validation of the process. Not only the validation of the resulting assembled board (solder joint...) but also a validation of every single machine in the line (ex. stencil printer...). For exam

fine pitch printing

Electronics Forum | Wed May 17 13:48:37 EDT 2006 | dwelch123

I'm having trouble printing leads on a fine pitch part. The lead is only .008". I'm using a DEK 265 with metal squeegee and using WS200 multicore solder paste.The stencil is laser cut and polished. I've experimented with different pressures and diffe

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