Electronics Forum: stencil (Page 199 of 540)

Streaking at Screen Printing

Electronics Forum | Fri Dec 15 10:58:32 EST 2006 | pms

Yes we see this also....... It is what they call "cold welding" of the solder paste to the blades...... The solder spheres actually "weld" together...... It leaves streaks on the stencil, not a clean wipe of the stencil....... We have never found

Tooling and Stencil Design

Electronics Forum | Sat Dec 16 09:47:53 EST 2006 | Frank

Hi all, Having been designing (3d modelling and programming) stencils and tooling (solderwave carriers,print support etc) for several years I am now investigating whether it would be possible to do this from home. I live in the UK and am therefore ab

Solder paste handing

Electronics Forum | Tue Jan 16 10:19:36 EST 2007 | slthomas

Then how do we explain the poor printing performance (appears to be rheology based, paste thickening/drying, poor aperture fill, sticking to the blades, etc.) of paste that has exceeded it's shelf life? You know, the stuff that no amount of stirring

Pump Stencil

Electronics Forum | Fri Jan 19 10:18:44 EST 2007 | Simon C

Hi, We have at DEK printed paste through a Pumprint stencil onto clinched leads, but there will be limitations depending on the product. If you can send a sample loaded board to me indicating where you want paste deposits then I can certainly take a

Printing off contact

Electronics Forum | Wed Feb 07 07:36:11 EST 2007 | jax

mk, Should I read into the fact that you posted this on a sipad website? You could always add an etch process to you stencil design to gasket around the raised mask locations. It is currently done when additive etch's/trace's are used. The extra $20

Stencil Fiducials

Electronics Forum | Fri Feb 16 14:14:07 EST 2007 | wrongway

we use A EKRA X5 it can use A pad our the fiducial I generaly use A pab becuse most of our stencil don't come with the fiducials on them and our boards our HASAL and the fids our domed most of the time the smt pads work better for me

Clearance between Through hole and chip component

Electronics Forum | Wed Feb 28 11:43:20 EST 2007 | realchunks

Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem

Stencil design

Electronics Forum | Fri Mar 02 16:26:57 EST 2007 | Steve

1- Thickness 0.005" 2- I usually reduce 50% of the thermal pad, but it also depend on original size of thermal pad somehow I have to either create window panel or crosshatch otherwise component wil get wimming during reflow. Hope this will help. Reg

Stencil design

Electronics Forum | Thu Mar 08 18:39:06 EST 2007 | elias67

Stencil Thickness should be .005" A reduction along with cross hatching is a must for the center pad to reduce paste volume as well as to assure even paste deposit while printing on a large pad. With out the cross hatch, the squeegie will most like

0402 aperture design lf

Electronics Forum | Tue Apr 24 02:56:12 EDT 2007 | chrispy1963

If the PCB you are using is a HASL pad finish and is a leaded assembly, we use homeplate pads with a 5 mil stencil. If the circuit has Enig finish and is PB-Free then we use 1:1 apertures with a 5 mil stencil Either method should provide no solde


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