Electronics Forum: stencil (Page 202 of 540)

Bottom side adheasive

Electronics Forum | Wed Dec 10 07:47:16 EST 2008 | benefon

If you find the correct type of adhesive/needle size then dispensing certainly is no problem. With a footed needle a very repeatable process too. Much more flexible than stencil printing and no need to mess around with stencil cleaning. But with auge

Solventless Under Stencil Cleaning

Electronics Forum | Wed Feb 04 06:48:34 EST 2009 | muarty

Has anyone any experience of using completely dry under stencil cleaning. I have recently been sent some information regarding Micro�Wipe� FP cleaning rolls. The claims about their performance are pretty good, but then what are they like in reality?

Solventless Under Stencil Cleaning

Electronics Forum | Wed Feb 04 08:00:30 EST 2009 | milroy

Hi, It depends on the stencil thickness, aperture size and the component footprint. For exampl if you have a PCB with QFP,CSP,QFN & BGA parts then this underwiper is not useable because you will still find solder cream deposits in the apertures aft

Stencil design (maybe old) question...

Electronics Forum | Thu Feb 05 02:34:05 EST 2009 | sachu_70

Hi Manuel, most passives are chip components. These tend to self-center/align during the reflow process. However, you need to ensure that there is a uniform balanced solder paste deposit. I had tried few such ovals in earlier stencil designs and resu

High complex board manufacturing

Electronics Forum | Mon Mar 02 10:23:46 EST 2009 | wrongway

You may need a glue despinser if you populate bottom side then wave. maybe a board deatacker at front of the line how about a multifunction pick and place machine so you can process all parts out there. we cleaned our stencils for years then we got a

Solder paste process

Electronics Forum | Thu Apr 23 21:07:09 EDT 2009 | luismolinero

Emilio: Several factors you need to take into account and your process parameters will depend on: Solder Alloy, Is there any Fine Pitch?; BGA?; Smaller chip size?. Tipically you should go for controls in: Solder Temperature and viscosity; blade and s

Solder paste process

Electronics Forum | Thu Apr 30 12:59:16 EDT 2009 | realchunks

I have run design of experiments on screen printers and most times people forget about the type of board you are running; the condition of the board; manufacturer of the paste as I have seen Type 4 no-clean no-lead pastes react very differently using

Equipments required for making SMD PCB's

Electronics Forum | Mon Jun 29 11:15:12 EDT 2009 | davef

Here on SMTnet, we've talked about using toaster ovens to reflow solder paste previously. Search the fine SMTnet Archives for more. Here's a clip from one of those threads: Look here: http://www.pcbexpress.com/stencils/stencil_article_page1.htm

SMT Stencil Printer upgrade worth the cost?

Electronics Forum | Thu Aug 27 12:34:05 EDT 2009 | dpeebles

We have an inline MPM 25 HiE with 2D inspection. We are needing to put in a 2nd line. We have ordered another identical used stencil printer but are wondering if we should upgrade to a newer machine with 3D inspection, automated paste, etc. Will

Stencil Cleaners- Sn/Pb & Pb Free

Electronics Forum | Mon Aug 31 09:55:09 EDT 2009 | pjc

What is the common practice for cleaning Tin/Lead and Lead Free solderpaste on stencils- some machines have filtration I'm told, so its not an issue according to the mfrs. On machines that don't have filtration do you run one after the other? Do you

stencil searches for Companies, Equipment, Machines, Suppliers & Information